Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same

Patent metadata

Field	Value
Publication number	US-10683440-B2
Application number	US-201916386925-A
Country	US
Kind code	B2
Filing date	Apr 17, 2019
Priority date	Aug 5, 2013
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

First claim

What is claimed is:

1. A pressure-sensitive adhesive composition comprising an encapsulating resin comprising a copolymer of a diene and an olefin-based compound haying one carbon-carbon double bond, a tackifier and an active energy rav-polymerizable compound included at 5 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin, wherein the active energy ray-polymerizable compound satisfies Formula 1:

where R 1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue inducted from a linear, branched, or cyclic alkyl group having 3 to 30 carbon atoms, wherein the pressure sensitive adhesvie composition has a gel content represented by Equation 1 of 50% or more, a micro gel content represented by Equation 2 of 3% or less, and a water vapor transmission rate in a thickness direction while being formed in a film having a thickness of 100 μm of 50 g/m 2 , day or less:
Gel content (wt %)= B/A× 100   [Equation 1]

Micro gel content (wt %)= C/A× 100   [Equation 2]

wherein in Equations 1 and 2, A is a mass of the pressure-sensitive adhesive composition,
in Equation 1, B is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours and filtered through a 200-mesh sieve (pore size of 200 μm), and
in Equation 2, C is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours, primarily filtered through a 200-mesh sieve (pore size: 200 μm), and secondarily filtered through a 1000-mesh sieve (pore size: 5 μm).

2. The composition according to claim 1 , which has a gel content represented by Equation 1 of 50 to 99%.

3. The composition according to claim 1 , which has a light transmittance of 85% or more with respect to a visible-ray region while being formed in a film.

4. The composition according to claim 1 , which has a haze of 3% or less while being formed in a film.

5. The composition according to claim 1 , further comprising:
a radical initiator.

6. The composition according to claim. 1 , further comprising:
a moisture absorbent.

7. A pressure-sensitive adhesive film, comprising a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer comprises the pressure-sensitive adhesive composition of claim 1 or a crosslinked product thereof.

8. The pressure-sensitive adhesive film according to claim 7 , wherein the film comprises a first layer having the pressure-sensitive adhesive layer and a second layer having a pressure-sensitive adhesive resin or an adhesive resin.

9. The pressure-sensitive adhesive film according to claim 7 , which has a light transmittance of 85% or more with respect to a visible-ray region.

10. The pressure-sensitive adhesive film according to claim 7 , which has a haze of 3% or less.

11. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
the pressure-sensitive adhesive film according to claim 7 encapsulate the organic electronic element.

12. A method of manufacturing an organic electronic device, comprising:
applying the pressure-sensitive adhesive film of claim 7 to a substrate on which an organic electronic element is formed in order to cover the organic electronic element; and
curing the pressure-sensitive adhesive film.

Assignees

• Lg Chemical Ltd

Inventors

• Cho Yoon Gyung
• Bae Kyung Yul
• Park Min Soo
• Shim Jung Sup
• Yoo Hyun Jee

Classifications

• H10K99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• C09J123/00

  Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers · CPC title

• C09J7/385

  Acrylic polymers · CPC title

• C09J9/00 Primary

  Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) · CPC title

• H10K50/841

  Self-supporting sealing arrangements · CPC title