Thermosetting epoxy resin composition and production method for same

Patent metadata

Field	Value
Publication number	US-10669458-B2
Application number	US-201716302831-A
Country	US
Kind code	B2
Filing date	Jun 6, 2017
Priority date	Jun 15, 2016
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

Provided is a thermosetting epoxy resin composition, including: an epoxy resin; a latent curing agent which is porous particles formed of a polyurea resin and supporting an aluminum chelate; and boric acid.

First claim

The invention claimed is:

1. A thermosetting epoxy resin composition, comprising:
an epoxy resin;
a latent curing agent which is porous particles formed of a polyurea resin and supporting an aluminum chelate; and
boric acid.

2. The thermosetting epoxy resin composition according to claim 1 , further comprising:
an organosilane compound.

3. The thermosetting epoxy resin composition according to claim 2 ,
wherein the organosilane compound comprises at least one of an aryl silanol compound and a silane coupling agent.

4. The thermosetting epoxy resin composition according to claim 2 ,
wherein the boric acid is derived from a boric acid ester during preparation of the thermosetting epoxy resin composition; and
wherein a ratio by mass (organosilane compound:boric acid ester) between a blending amount of the organosilane compound and a blending amount of the boric acid ester during preparation of the thermosetting epoxy resin composition is from 1:3 through 3:1.

5. The thermosetting epoxy resin composition according to claim 1 ,
wherein the epoxy resin comprises an alicyclic epoxy resin.

6. The thermosetting epoxy resin composition according to claim 5 ,
wherein the alicyclic epoxy resin comprises at least one of compounds represented by structural formulae below,

7. The thermosetting epoxy resin composition according to claim 1 ,
wherein the porous particles further comprise a vinyl resin as a constituent component.

8. The thermosetting epoxy resin composition according to claim 1 ,
wherein a surface of the porous particles comprises a reaction product of an alkoxysilane coupling agent.

Assignees

• Dexerials Corp

Inventors

• Kamiya Kazunobu

Classifications

• C09J2463/00

  Presence of epoxy resin · CPC title

• C09J11/08

  Macromolecular additives · CPC title

• C09J11/06

  organic · CPC title

• C08K5/54

  Silicon-containing compounds {(C08K5/0091 takes precedence)} · CPC title

• C08G18/707

  the liquid medium being a compound containing active hydrogen not comprising water · CPC title