Ferrite powder for bonded magnets, method for producing the same and ferrite bonded magnet

US10665371B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10665371-B2
Application numberUS-201515515902-A
CountryUS
Kind codeB2
Filing dateSep 30, 2015
Priority dateSep 30, 2014
Publication dateMay 26, 2020
Grant dateMay 26, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A ferrite powder for bonded magnets having a high iHc value usable even in a low temperature environment, a method for producing the same, and a bonded magnet using the ferrite powder and having high iHc value which can be used even in a low temperature environment, wherein a specific surface area is 2.20 m 2 /g or more and less than 3.20 m 2 /g; a compression density is 3.30 g/cm 3 or more and less than 3.60 g/cm 3 , and a compressed molding has a coercive force of 3250 Oe or more and less than 3800 Oe.

First claim

Opening claim text (preview).

The invention claimed is: 1. A ferrite powder for bonded magnets, wherein: a specific surface area is 2.20 m 2 /g or more and less than 3.20 m 2 /g; a compression density is 3.30 g/cm 3 or more and less than 3.60 g/cm 3 , and a coercive force of the ferrite powder after having been compressed under a pressure of 2 tons/cm 2 is 3250 Oe or more and less than 3800 Oe.

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What does patent US10665371B2 cover?
A ferrite powder for bonded magnets having a high iHc value usable even in a low temperature environment, a method for producing the same, and a bonded magnet using the ferrite powder and having high iHc value which can be used even in a low temperature environment, wherein a specific surface area is 2.20 m 2 /g or more and less than 3.20 m 2 /g; a compression density is 3.30 g/cm 3 or more an…
Who is the assignee on this patent?
Dowa Electronics Materials Co Ltd, Dowa F Tec Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01F1/0315. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 26 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).