Wireless printed circuit board assembly with integral radio frequency waveguide

Patent metadata

Field	Value
Publication number	US-10658739-B2
Application number	US-201715586589-A
Country	US
Kind code	B2
Filing date	May 4, 2017
Priority date	May 4, 2017
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

An printed circuit board (PCB) assembly and method of assembling the same for a high-speed, short-reach communication link are described that provide a mechanism for transmitting radio frequency (RF) waves from one digital electronic component of the PCB assembly to another, where the second digital electronic component is located either on the same PCB assembly or on a second PCB assembly. The assembly includes a PCB having multiple layers and a digital electronic component supported by the PCB. At least one of the layers defines a channel that confines RF waves therein. An RF antenna in communication with the digital electronic component extends into the channel, and the RF antenna transmits RF signals generated by the digital electronic component into the channel as RF waves or receives RF waves via the channel and conveys corresponding RF signals to the digital electronic component.

First claim

What is claimed is:

1. A printed circuit board assembly for a high-speed, short-reach communication link, the assembly comprising:
a printed circuit board comprising a plurality of layers;
a digital electronic component supported by the printed circuit board, wherein the digital electronic component is configured to convert between electrical signals and radio frequency signals, wherein each of at least two of the plurality of layers defines an array of channels, each channel configured to confine radio frequency waves therein; and
a radio frequency antenna disposed in each channel, wherein each radio frequency antenna is in communication with the digital electronic component and with the respective channel, wherein each radio frequency antenna is configured to transmit radio frequency signals generated by the digital electronic component into the respective channel as radio frequency waves or to receive radio frequency waves via the respective channel and convey corresponding radio frequency signals to the digital electronic component.

2. The printed circuit board assembly of claim 1 , wherein the channel comprises conductive walls surrounding a dielectric material configured to propagate the radio frequency waves therethrough.

3. The printed circuit board assembly of claim 1 , wherein the channel comprises conductive walls surrounding a hollow center configured to propagate the radio frequency waves therethrough.

4. The printed circuit board assembly of claim 1 , wherein the antenna extends into the channel.

5. The printed circuit board assembly of claim 1 , wherein the antenna is disposed in a substrate of the digital electronic component, wherein the radio frequency waves are propagated to the channel using metallic VIAs.

6. The printed circuit board assembly of claim 1 , wherein the channel extends from the digital electronic component to an edge of the printed circuit board.

7. The printed circuit board assembly of claim 6 further comprising a connector proximate the edge of the printed circuit board, wherein the channel is configured to transmit the radio frequency waves between the digital electronic component and the connector and wherein the connector is configured to pass the radio frequency waves between the printed circuit board assembly and a second printed circuit board assembly.

8. The printed circuit board assembly of claim 6 further comprising a plastic waveguide in communication with the channel, wherein the channel is configured to transmit the radio frequency waves between the digital electronic component and the plastic waveguide and wherein the plastic waveguide is configured to pass the radio frequency waves between the printed circuit board assembly and a second printed circuit board assembly.

9. The printed circuit board assembly of claim 1 , wherein the digital electronic component is a first digital electronic component, the printed circuit board assembly further comprising a second digital electronic component supported by the printed circuit board, wherein the channel extends between the first digital electronic component and the second digital electronic component.

10. The printed circuit board assembly of claim 1 , wherein the digital electronic component comprises a component selected from the group consisting of a processor, a switch, a network interface card (NIC), a microcontroller, a driver, and a transimpedance amplifier (TIA).

11. The printed circuit board assembly of claim 1 , wherein channels defined in a first layer of the printed circuit board are staggered with respect to channels defined in a second layer of the printed circuit board.

12. A method of assembling a printed circuit board assembly for a high-speed, short-reach communication link, the method comprising: forming a printed circuit board comprising a plurality of layers, wherein forming the printed circuit board comprises defining an array of channels in each of at least two of the plurality of layers, and wherein each channel is configured to confine radio frequency waves therein; disposing a digital electronic component on the printed circuit board, wherein the digital electronic component is configured to convert between electrical signals and radio frequency signals; and forming a radio frequency antenna in each channel, wherein each radio frequency antenna is in communication with the digital electronic component, wherein each antenna is configured to transmit radio frequency signals generated by the digital electronic component into the respective channel as radio frequency waves or to receive radio frequency waves via the respective channel and convey corresponding radio frequency signals to the digital electronic component.

13. The method of claim 12 , wherein defining the channel comprises surrounding a dielectric material with conductive walls.

14. The method of claim 12 , wherein defining the channel comprises surrounding a hollow center with conductive walls.

15. The method of claim 12 , wherein defining the channel comprises defining the channel from the digital electronic component to an edge of the printed circuit board, the method further comprising disposing a connector proximate the edge of the printed circuit board, wherein the channel is configured to transmit the radio frequency waves between the digital electronic component and the connector and wherein the connector is configured to pass the radio frequency waves between the printed circuit board assembly and a second printed circuit board assembly.

16. The method of claim 12 , wherein defining the channel comprises defining the channel from the digital electronic component to an edge of the printed circuit board, the method further comprising disposing a plastic waveguide in communication with the channel, wherein the channel is configured to transmit the radio frequency waves between the digital electronic component and the plastic waveguide and wherein the plastic waveguide is configured to pass the radio frequency waves between the printed circuit board assembly and a second printed circuit board assembly.

17. The method of claim 12 , wherein the digital electronic component is a first digital electronic component, the method further comprising disposing a second digital electronic component on the printed circuit board and defining the channel between the first digital electronic component and the second digital electronic component.

18. The method of claim 12 , wherein defining the channels comprises defining channels in a first layer of the printed circuit board that are staggered with respect to channels defined in a second layer of the printed circuit board.

Assignees

• Mellanox Technologies Ltd

Inventors

• Mentovich Elad
• Gridish Yaakov
• Wertheim Oded
• Rockman Sylvie
• Koren Benny

Classifications

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H01P5/12

  Coupling devices having more than two ports (H01P5/04 takes precedence) · CPC title

• H01Q13/0283

  Apparatus or processes specially provided for manufacturing horns · CPC title

• H01P1/2088

  Integrated in a substrate · CPC title