Evaporation plate for depositing deposition material on substrate, evaporation apparatus, and method of depositing deposition material on substrate

Patent metadata

Field	Value
Publication number	US-10658630-B2
Application number	US-201716300186-A
Country	US
Kind code	B2
Filing date	Nov 1, 2017
Priority date	Nov 1, 2017
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

The present application discloses an evaporation plate for depositing a deposition material on a substrate. The evaporation plate has a first side and a second side opposite to the first side. The evaporation plate includes a main body plate; a first cooling layer on the main body plate and on the first side of the evaporation plate; and a first heating layer on a side of the first cooling layer distal to the main body plate. The first cooling layer is configured to cool the first heating layer on the first side of the evaporation plate. The first heating layer is configured to heat a material deposited on the first side of the evaporation plate.

First claim

What is claimed is:

1. An evaporation plate for depositing a deposition material on a substrate, comprising a sequentially stacked structure:
wherein the sequentially stacked structure comprises:
a first heating layer;
a first cooling layer;
a main body plate;
a second cooling layer; and
a second heating layer;
wherein the first cooling layer and the first heating layer are sequentially stacked on a first side of the main body plate;
the second cooling layer and the second heating layer are sequentially stacked on a second side of the main body plate;
the second side is opposite to the first side;
the main body plate is between the first cooling layer and the second cooling layer;
the first cooling layer is between the first heating layer and the main body plate, and is configured to cool the first heating layer on the first side of the main body plate;
the first heating layer is configured to heat a first material deposited on the first side of the main body plate;
the second cooling layer is between the second heating layer and the main body plate, and is configured to cool the second heating layer on the second side of the main body plate; and
the second heating layer is configured to heat a second material deposited on the second side of the main body plate.

2. The evaporation plate of claim 1 ,
wherein the main body plate is in direct contact with the first cooling layer on the first side, and is in direct contact with the second cooling layer on the second side;
the first cooling layer is in direct contact with the main body plate on one side and is in direct contact with the first heating layer on another side; and
the second cooling layer is in direct contact with the main body plate on one side and is in direct contact with the second heating layer on another side.

3. The evaporation plate of claim 1 , further comprising:
a first heat spreading layer on a side of the first heating layer away from the first cooling layer, and configured to distribute heat transmitted from the first heating layer; and
a second heat spreading layer on a side of the second heating layer away from the second cooling layer, and configured to distribute heat transmitted from the second heating layer;
wherein the first cooling layer is configured to cool the first heating layer and the first heat spreading layer on the first side of the main body plate;
the first heating layer is between the first heat spreading layer and the first cooling layer, and is configured to heat a material deposited on the first heat spreading layer through the first heat spreading layer;
the second cooling layer is configured to cool the second heating layer and the second spreading layer on the second side of the main body plate; and
the second heating layer is between the second heat spreading layer and the second cooling layer, and is configured to heat a material deposited on the second heat spreading layer through the second heat spreading layer.

4. The evaporation plate of claim 1 , further comprising a pivot configured to rotate the evaporation plate between a first position and a second position.

5. An evaporation apparatus, comprising the evaporation plate of claim 1 .

6. The evaporation apparatus of claim 5 , further comprising a plurality of nozzles configured to spread an evaporated deposition material onto the evaporation plate.

7. The evaporation apparatus of claim 6 ,
wherein the main body plate is in direct contact with the first cooling layer on the first side, and is in direct contact with the second cooling layer on the second side;
the first cooling layer is in direct contact with the main body plate on one side and is in direct contact with the first heating layer on another side;
the second cooling layer is in direct contact with the main body plate on one side and is in direct contact with the second heating layer on another side.

8. The evaporation apparatus of claim 6 , wherein the evaporation plate further comprises:
a first heat spreading layer on a side of the first heating layer away from the first cooling layer, and configured to distribute heat transmitted from the first heating layer; and
a second heat spreading layer on a side of the second heating layer away from the second cooling layer, and configured to distribute heat transmitted from the second heating layer;
wherein the first cooling layer is configured to cool the first heating layer and the first heat spreading layer on the first side of the main body plate;
the first heating layer is configured to heat a material deposited on the first heat spreading layer through the first heat spreading layer;
the second cooling layer is configured to cool the second heating layer and the second spreading layer on the second side of the main body plate; and
the second heating layer is configured to heat a material deposited on the second heat spreading layer through the second heat spreading layer.

9. The evaporation apparatus of claim 6 , wherein the evaporation plate is configured to rotate between a first position and a second position;
wherein the plurality of nozzles face the first side of the main body plate when the evaporation plate is at the first position, and are configured to spread the evaporated deposition material onto the first side of the main body plate at the first position; and
the plurality of nozzles face the second side of the main body plate when the evaporation plate is at the second position, and are configured to spread the evaporated deposition material onto the second side of the main body plate at the second position.

10. The evaporation apparatus of claim 9 , wherein the second heating layer is configured to heat a deposition material spread on the second side of the main body plate when the evaporation plate is at the first position; and
the first heating layer is configured to heat a deposition material spread on the first side of the main body plate when the evaporation plate is at the second position.

11. The evaporation apparatus of claim 9 , further comprising a pivot coupled to the evaporation plate and configured to rotate the evaporation plate between the first position and the second position.

12. The evaporation apparatus of claim 6 , further comprising a deposition-preventing plate between the evaporation plate and the plurality of nozzles;
wherein the deposition-preventing plate has an opening exposing the evaporation plate;
the plurality of nozzles are movable relative to the opening; and
deposition of the evaporated deposition material on the evaporation plate is prevented when the plurality of nozzles are outside a region corresponding to the opening.

13. A method of depositing a deposition material on a substrate, comprising:
providing an evaporation apparatus comprising an evaporation plate and a plurality of nozzles, wherein the evaporation plate comprises a sequentially stacked structure, wherein the sequentially stacked structure comprises a first heating layer; a first cooling layer; a main body plate; a second cooling layer; and a second heating layer, wherein the first cooling layer and the first heating layer are sequentially stacked on a first side of the main body plate; the second cooling layer and the second heating layer are sequentially stacked on a second side of the main body plate; the second side is opposite to the first side; the main body plate is between the first cooling layer and the second cooling layer; the first cooling layer is between the first heating layer and the main body plate, and is configured to cool the first heating layer on the first side of the main body plate; the first heating

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Yao Gu
• Zou Qinghua
• Duan Tingyuan

Classifications

• C23C14/042

  using masks · CPC title

• C23C14/24

  Vacuum evaporation · CPC title

• C23C14/541

  Heating or cooling of the substrates · CPC title

• H01L51/56 Primary

  Electricity · mapped topic

• H01L51/001

  Electricity · mapped topic