Resin blend for melting process

Patent metadata

Field	Value
Publication number	US-10655003-B2
Application number	US-201113879504-A
Country	US
Kind code	B2
Filing date	Oct 14, 2011
Priority date	Oct 14, 2010
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

The present invention relates to a resin blend for a melting process, to a method for manufacturing a resin molding using same, and to a resin molding obtained thereby, the resin blend comprising a first resin and a second resin, wherein the second resin includes a polymer resin having at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic ring having 5 to 40 carbon atoms and an aromatic ring having 6 to 40 carbon atoms, and has, with the first resin, a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s −1 and a processing temperature of the resin mixture, and a glass transition temperature (T g ) difference of 10° C. to 150° C.

First claim

What is claimed is:

1. A resin blend for a melting process comprising a first resin and a second resin,
wherein the first resin comprises an acrylate-based resin,
wherein the second resin comprises a (meth)acrylate-based resin to which at least one organic functional group selected from the group consisting of tertiary butyl group, isobornyl group, cyclohexyl group, and phenyl group is introduced, and has a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s −1 at a processing temperature of the resin blend and a glass transition temperature (T g ) difference of 10° C. to 100° C. with respect to the first resin,
wherein the resin blend forms a layer-separated structure in which the second resin forms on a surface of the first resin in the layer-separated structure during melt processing under shear stress,
wherein the resin blend has an impact resistance of 6.7 to 8.8 kg*cm/cm in an IZOD ⅛″ test and of 6.5 to 9.1 kg*cm/cm in an IZOD ¼″ test measured according to ASTM D256, and
wherein the resin blend has a pencil hardness of 2H to 3H measured according to ASTM 3363-74.

2. The resin blend of claim 1 , wherein the melt viscosity difference between the first resin and the second resin at the shear rate of 100 to 1,000 s −1 at the processing temperature of the resin blend is in a range of 0.1 to 2,000 Pa*s.

3. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having a tertiary butyl group functional group.

4. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having an isobornyl functional group.

5. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having a cyclohexyl functional group.

6. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having a phenyl functional group.

Assignees

• Yoo Houng Sik
• Ryu Jin Young
• Kim Hak Shin
• Choi Eun Joo
• Hong Young Jun
• Yang Hyun Seok
• Lg Chemical Ltd

Inventors

• Yoo Houng Sik
• Ryu Jin Young
• Kim Hak Shin
• Choi Eun Joo
• Hong Young Jun
• Yang Hyun Seok

Classifications

• Y10T428/2998

  including synthetic resin or polymer · CPC title

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

• C08L33/14

  of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen · CPC title

• C08L33/20 Primary

  Homopolymers or copolymers of acrylonitrile (C08L55/02 takes precedence) · CPC title

• B32B7/02

  Physical, chemical or physicochemical properties · CPC title