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Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device
US8969490B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969490-B2 |
| Application number | US-92140109-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 24, 2009 |
| Priority date | Mar 25, 2008 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.
First claim
Opening claim text (preview).
The invention claimed is: 1. An epoxy resin composition comprising: (A) an epoxy resin, (B) a phenoxy resin having a bisphenol acetophenone structure represented by the following formula (1) and a weight average molecular weight of 1.0×10 4 or more, and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition:…
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Classifications
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C08L71/00Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US8969490B2 cover?
- An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a p…
- Who is the assignee on this patent?
- Ohigashi Noriyuki, Kimura Michio, Murakami Haruo, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification C08L71/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).