Planar glass sealing structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10647091-B2
Application number	US-201314115369-A
Country	US
Kind code	B2
Filing date	Jun 27, 2013
Priority date	Apr 27, 2013
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.

First claim

The invention claimed is:

1. A manufacturing method of a planar glass sealing structure, wherein the manufacturing method of a planar glass sealing structure comprises steps of:
providing a first glass substrate;
disposing a frame-shaped insulating layer on a peripheral margin of an upper surface of the first glass substrate;
providing a second glass substrate;
coating a frame-shaped solid metal solder layer on a peripheral margin of a lower surface of the second glass substrate, wherein a coated area of the solid metal solder layer is corresponding to an installing area of the insulating layer; and the metal solder layer is coated by:
grinding a metal solder into powder and then using a powder metallurgy method to form a solid sinter of the metal solder with a certain width and height on the sealing glass; or
grinding a metal solder into powder and then adding the powder into an organic solvent with a certain viscosity to compound it as a paste with a certain viscosity, and coating the paste on the sealing glass and then evaporating the organic solvent, so as to form a solid metal solder film with a certain width and height;

correspondingly assembling the lower surface of the second glass substrate to the upper surface of the first glass substrate, wherein the metal solder layer is pressed onto the insulating layer; and
heating to melt the metal solder layer to be respectively soldered with the second glass substrate thereabove and the first glass substrate thereunder, so as to form a metal sealing frame, and the first glass substrate and the second glass substrate have a fixed gap therebetween kept by the metal sealing frame, and an inner space thereof is kept in a sealed condition;
wherein the solid metal solder layer is formed prior to the step of assembling the lower surface of the second glass substrate to the upper surface of the first glass substrate and the step of heating to melt the metal solder layer;
wherein the certain width and height are maintained after the step of assembling the lower surface of the second glass substrate to the upper surface of the first glass substrate.

2. The manufacturing method of the planar glass sealing structure according to claim 1 , wherein the step of correspondingly assembling the lower surface of the second glass substrate to the upper surface of the first glass substrate is processed under a vacuum environment.

3. The manufacturing method of the planar glass sealing structure according to claim 1 , wherein the insulating layer is an insulating layer of inorganic insulating materials.

4. The manufacturing method of the planar glass sealing structure according to claim 3 , wherein the inorganic insulating materials are selected from silicon or silica.

5. The manufacturing method of the planar glass sealing structure according to claim 1 , wherein the melting point of the material of the metal sealing frame is lower than the melting point of the first and second glass substrate.

6. The manufacturing method of the planar glass sealing structure according to claim 5 , wherein the thermal expansion coefficient of the metal sealing frame is close or equal to the thermal expansion coefficient of the first and second glass substrate.

7. The manufacturing method of the planar glass sealing structure according to claim 6 , wherein the materials of the metal sealing frame are selected from tin, tin alloy, indium or indium alloy.

8. The manufacturing method of the planar glass sealing structure according to claim 1 , wherein a width of the metal sealing frame is smaller than a width of the insulating layer.

9. The manufacturing method of the planar glass sealing structure according to claim 1 , wherein the planar glass sealing structure is a glass substrate structure of organic light-emitting diode flat light source or display; and the first glass substrate is an active glass substrate and the second glass substrate is an encapsulation glass substrate.

10. The manufacturing method of the planar glass sealing structure according to claim 1 , wherein the planar glass sealing structure is a glass substrate structure of liquid crystal display; and the first glass substrate is an array glass substrate and the second glass substrate is a color filter substrate.

Assignees

• Shenzhen China Star Optoelect

Inventors

• Liu Yawei
• Wu Tai-Pi
• Liu Chih-Che

Classifications

• E06B3/66357

  Soldered connections or the like · CPC title

• B32B2457/206

  Organic displays, e.g. OLED · CPC title

• B32B17/061 Primary

  of metal · CPC title

• Y10T428/12396

  Discontinuous surface component · CPC title

• E06B3/66376

  comprising lighting means · CPC title