Laminate and method for separating the same

Patent metadata

Field	Value
Publication number	US-9492986-B2
Application number	US-201113881114-A
Country	US
Kind code	B2
Filing date	Oct 7, 2011
Priority date	Oct 29, 2010
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of an inorganic material and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting layer, and the release layer having a flat surface which faces the adhesive layer.

First claim

What is claimed is:

1. A method for separating a supporting member and a silicon wafer from each other which are included in a laminate, the laminate including:
the supporting member which is light transmissive;
the silicon wafer supported by the supporting member;
an adhesive layer provided on a surface of the silicon wafer, wherein said surface faces toward the supporting member; and
a release layer which is made of an inorganic material and is provided between the supporting member and the silicon wafer, wherein
the release layer has a property that changes so that the release layer has a reduced material strength when it absorbs light coming through the supporting member,
wherein the supporting member, the release layer, the adhesive layer, and the silicon wafer are stacked together in this order in the laminate,
said method comprising changing the property of the release layer so that the release layer has a reduced material strength by irradiating the release layer with light through the supporting member; and
breaking the release layer.

2. The method as set forth in claim 1 , wherein the inorganic material is at least one selected from the group consisting of a metal, a metal compound, and carbon.

3. The method as set forth in claim 1 , wherein the inorganic material is at least one selected from the group consisting of gold, platinum, palladium, cobalt, rhodium, iridium, calcium, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, bismuth, antimony, lead, silver, copper, iron, nickel, aluminum, titanium, chrome, tin, alloys of these metals, SiO 2 , SiN, Si 3 N 4 , TiN, and carbon.

4. The method as set forth in claim 1 , further comprising at least one layer provided between the supporting member and the release layer.

5. The method as set forth in claim 1 , wherein the adhesive layer is made of a hydrocarbon adhesive.

6. A laminate comprising:
a supporting member which is light transmissive;
a silicon wafer supported by the supporting member;
an adhesive layer provided on a surface of the silicon wafer, wherein said surface faces toward the supporting member; and
a release layer which is made of an inorganic material and is provided between the supporting member and the silicon wafer,
the release layer having a property that changes so that the release layer has a reduced material strength when it absorbs light coming through the supporting member,
the release layer having a flat surface which faces the adhesive layer, and wherein the supporting member, the release layer, the adhesive layer, and the silicon wafer are stacked together in this order, wherein:
the inorganic material is a metal or a metal compound; and
the laminate comprises, on at least one surface of the release layer, an anti-reflection film or an antistatic film.

7. The laminate as set forth in claim 6 , wherein the adhesive layer is made of a hydrocarbon adhesive.

Assignees

• Inao Yoshihiro
• Fujii Yasushi
• Matsushita Atsushi
• Tamura Koki
• Kubo Atsushi
• Tokyo Ohka Kogyo Co Ltd

Inventors

• Inao Yoshihiro
• Fujii Yasushi
• Matsushita Atsushi
• Tamura Koki
• Kubo Atsushi

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title

• B32B17/061

  of metal · CPC title