Molding process for insulation product

US10647050B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10647050-B2
Application numberUS-201916386633-A
CountryUS
Kind codeB2
Filing dateApr 17, 2019
Priority dateMar 13, 2013
Publication dateMay 12, 2020
Grant dateMay 12, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the operation of transferring heat to the insulation material to cause the binder to cure.

First claim

Opening claim text (preview).

The invention claimed is: 1. A molding process for molding a cured product, the molding process comprising providing an uncured blank including fibers and uncured binder, inserting the uncured blank in a mold cavity formed in a mold, closing the mold to trap the uncured blank in the mold cavity to cause the uncured blank to assume a molded shape, transferring a shaping heat to the uncured blank to cause a portion of the binder to be cured so that the molded shape is retained after the removal from the mold and a shaped product is established, opening the mold to release the shaped product, inserting the shaped product in a heater, and transferring a curing heat to the shaped product to cause a remainder of the uncured binder to cure so that a cured product is established, wherein curing of the binder consists essentially of a Maillard reaction. 2. The molding process of claim 1 , wherein the uncured binder is a substantially formaldehyde free binder. 3. The molding process of claim 1 , wherein during transferring the shaping heat, the shaping heat is applied by the mold. 4. The molding process of claim 1 , wherein during transferring the curing heat, the curing heat is applied by a heating unit in spaced-apart relation to the mold. 5. The molding process of claim 1 , wherein the uncured blank is exposed to a temperature of about 200 degrees Fahrenheit to about 500 degrees Fahrenheit. 6. The molding process of claim 1 , wherein transferring the shaping heat occurs during a first cycle time. 7. The molding process of claim 6 , wherein transferring the curing heat occurs during a second cycle time and the second cycle time is larger than the first cycle time. 8. The molding process of claim 1 , wherein the fibers are glass fibers. 9. The molding process of claim 1 , wherein the uncured binder comprises: at least 50% by dry weight of a carbohydrate reactant selected from one or more reducing sugars, one or more carbohydrate reactants that yield one or more reducing sugars in situ under thermal curing conditions and combinations thereof; and at least 10% by dry weight of a nitrogen-containing reactant selected from ammonia, ammonium salts, inorganic amines, inorganic amine salts, organic amines comprising at least one primary amine group, salts of organic amines comprising at least one primary amine group, and combinations thereof. 10. The molding process of claim 9 wherein the carbohydrate reactant comprises high-fructose corn syrup. 11. The molding process of claim 9 wherein the nitrogen-containing reactant comprises ammonium sulfate, ammonium phosphate or combinations thereof. 12. The molding process of claim 1 , wherein the cured binder comprises a substantially water insoluble nitrogen containing polymer.

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Frequently asked questions

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What does patent US10647050B2 cover?
A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the operation of transferring heat to the insulation material to cause the binder to cure.
Who is the assignee on this patent?
Knauf Insulation Inc
What technology area does this patent fall under?
Primary CPC classification B29C35/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 12 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).