Soldering apparatus and method

Patent metadata

Field	Value
Publication number	US-10646945-B2
Application number	US-201815870257-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Jan 17, 2017
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.

First claim

What is claimed is:

1. A soldering apparatus comprising:
a soldering tool for performing a soldering operation, the soldering tool comprising a tip, wherein the soldering tool is movable relative to a substrate during the soldering operation;
a camera oriented toward the tip, the camera configured to generate image data of the soldering operation; and
a controller including a memory, the controller in communication with the camera, the controller configured to receive image data from the camera and to store the image data in the memory, the image data being stored in association with position data of the tip during the soldering operation, wherein the controller is configured to use an indicator previously stored in the memory to determine whether image data from the camera is to be stored in the memory.

2. The soldering apparatus of claim 1 , wherein the controller is configured to associate the image data with information on substrate type and with the position data of the tip during the soldering operation.

3. The soldering apparatus of claim 1 , further comprising a mount and a drive mechanism configured to move the mount relative to the substrate, wherein the mount carries the soldering tool, the controller is configured to control the drive mechanism, and the controller is configured determine whether the image data from the camera is to be stored in the memory.

4. The soldering apparatus of claim 3 , wherein the mount carries the camera.

5. The soldering apparatus of claim 3 , wherein the drive mechanism comprises a plurality of mechanical actuators for moving the mount in various axes of movement relative to the substrate, and each mechanical actuator is configured to move the mount in a different one of the axes.

6. The soldering apparatus of claim 1 , wherein the controller is configured to store, in the memory, image data for one or more images captured by the camera while the tip is moving during the soldering operation.

7. The soldering apparatus of claim 6 , wherein the image data corresponds to a plurality of still images captured at different times while the tip is moving during the soldering operation, and the controller is configured to combine the still images.

8. The soldering apparatus of claim 1 , wherein the controller is configured to store, in the memory, image data for one or more images captured by the camera while the tip is not moving.

9. The soldering apparatus of claim 1 , further comprising a computer in communication with the controller, wherein the controller is configured to send image data, which was received from the camera, to the computer, and the computer is configured to detect a soldering abnormality in the image data sent by the controller and configured to send an analysis result to the controller, the analysis result indicating whether a soldering abnormality was detected by the computer in the image data sent by the controller.

10. A soldering method comprising:
performing a soldering operation that comprises using a soldering tool to deposit solder on one or both of a substrate and a component portion on the substrate, wherein performing the soldering operation comprises moving the soldering tool according to position data in the memory;
capturing an image of the solder that was deposited;
storing image data corresponding to the image that was captured, the image data being stored in a memory, the image data being stored in association with the position data of the tip during the soldering operation
using a computer to analyze the image data and generate an analysis result indicating whether a soldering abnormality is present in the image data; and
storing the analysis result in the memory in association with the position data.

11. The method of claim 10 , wherein the soldering operation is a point soldering operation that deposits the solder at an operation endpoint, and the image that was captured is a still image showing the solder at the operation endpoint.

12. The method of claim 10 , wherein the soldering operation is a draw soldering operation that deposits the solder along a solder path that extends from an operation start point to an operation endpoint, and the image that was captured shows the solder path entirely.

13. The method of claim 12 , wherein the image that was captured is a video image showing the solder being deposited along the solder path.

14. The method of claim 12 , wherein the image that was captured comprises a plurality of still images, and each of the still images shows a different portion of the solder path.

15. The method of claim 10 , wherein the moving of the soldering tool is performed by a drive mechanism that is controlled according to the position data in the memory.

16. The method of claim 10 , wherein the memory has stored in it a plurality of indicators and information about a plurality of soldering operations, each one of the indicators is changeable to indicate whether image data should be stored for a corresponding one of the soldering operations, and at least one of the indicators indicates that image data should not be stored.

17. The method of claim 10 , further comprising:
performing a second soldering operation that comprises using the soldering tool to deposit solder on one or both of the substrate and a second component portion on the substrate;
capturing a second image, the second image showing the solder that was deposited during the second soldering operation; and
storing second image data corresponding to the second image that was captured, the second image data being stored in the memory, the image data being stored in association with the second soldering operation.

18. The soldering apparatus of claim 1 , wherein the position data is indicative of one or more coordinates.

19. A soldering apparatus comprising:
a soldering tool for performing a soldering operation, the soldering tool comprising a tip, wherein the soldering tool is movable relative to a substrate during the soldering operation;
a camera oriented toward the tip, the camera configured to generate image data of the soldering operation;
a controller including a memory, the controller in communication with the camera, the controller configured to receive image data from the camera and to store the image data in the memory, the image data being stored in association with position data of the tip during the soldering operation; and
a computer in communication with the controller, wherein the controller is configured to send image data, which was received from the camera, to the computer, and the computer is configured to detect a soldering abnormality in the image data sent by the controller and configured to send an analysis result to the controller, the analysis result indicating whether a soldering abnormality was detected by the computer in the image data sent by the controller.

20. The soldering apparatus of claim 19 , wherein the controller is configured to associate the image data with information on substrate type and with the position data of the tip during the soldering operation.

21. The soldering apparatus of claim 19 , further comprising a mount and a drive mechanism configured to move the mount relative to the substrate, wherein the mount carries the soldering tool, the controller is configured to control the drive mechanism, and the controller is configured determine whether the image data from the camera is to be stored in the memory.

22. The soldering apparatus of claim 21 , wherein the mount ca

Assignees

• Hakko Corp

Inventors

• Teraoka Yoshitomo

Classifications

• B23K3/04

  Heating appliances · CPC title

• B23K3/03 Primary

  electrically heated · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title

• B23K23/00

  Alumino-thermic welding · CPC title

• B23K3/0607

  Solder feeding devices · CPC title