Elastic wave device

Patent metadata

Field	Value
Publication number	US-10644669-B2
Application number	US-201916400111-A
Country	US
Kind code	B2
Filing date	May 1, 2019
Priority date	Dec 5, 2012
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.

First claim

What is claimed is:

1. An elastic wave device comprising:
a piezoelectric substrate;
a functional element unit that is provided on one principal surface of the piezoelectric substrate;
an electrode unit that is electrically connected to the functional element unit and extends to an end side of the piezoelectric substrate;
a support layer that is provided on the one principal surface of the piezoelectric substrate and encloses the functional element unit; and
a cover that is supported by the support layer and covers the functional element unit; wherein
the support layer is separate from the end side of the piezoelectric substrate and encloses the functional element unit;
the device further comprises a retaining member made of resin that is separate from the support layer on the piezoelectric substrate and extends to the end side of the piezoelectric substrate; and
the retaining member is not connected to the support layer.

2. The elastic wave device according to claim 1 , further comprising:
a connection unit that is provided on the one principal surface of the piezoelectric substrate; wherein
the retaining member covers an end portion of the connection unit.

3. A method for manufacturing the elastic wave device according to claim 1 , the method comprising:
forming a plurality of the functional element units in a matrix configuration on a motherboard; and
providing a dicing line between adjacent ones of the plurality of functional element units; wherein
in a region in which the dicing line is positioned, the retaining member is configured such that an area where the retaining member is not provided is larger than an area where the retaining member is provided.

4. The elastic wave device according to claim 1 , wherein the retaining member and the support layer are made of a same material.

5. The elastic wave device according to claim 1 , wherein the elastic wave device is one of a surface acoustic wave device and a boundary wave device.

6. A method for manufacturing the elastic wave device according to claim 1 , the method comprising:
forming a plurality of the functional element units on a motherboard; wherein
the plurality of functional element units are arranged in a matrix configuration on the motherboard.

7. The method for manufacturing the elastic wave device according to claim 6 , the method further comprising:
forming a connection line including a line main body on the motherboard; wherein
the retaining member includes an intersecting portion that is not connected to the support layer and intersects with the line main body.

8. The method of manufacturing the elastic wave device according to claim 7 , wherein only the intersecting portion of the retaining member is provided on the line main body and a portion of the retaining member other than the intersecting portion is not provided on the line main body.

Assignees

• Murata Manufacturing Co

Inventors

• Hira Mitsuyoshi
• Kai Seiji

Classifications

• H03H3/08 Primary

  for the manufacture of resonators or networks using surface acoustic waves · CPC title

• H03H2003/0478

  in a process for mass production · CPC title

• Y10T29/49005

  Acoustic transducer · CPC title

• H03H9/1092

  the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's · CPC title

• Y10T29/42

  Piezoelectric device making · CPC title