Multilayer structure with embedded multilayer electronics

Patent metadata

Field	Value
Publication number	US-10642433-B2
Application number	US-201916278299-A
Country	US
Kind code	B2
Filing date	Feb 18, 2019
Priority date	Apr 13, 2016
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

First claim

The invention claimed is:

1. An integrated multilayer assembly for an electronic device comprising:
a first substrate film configured to accommodate electrical features on at least a first side thereof, the first substrate film having the first side and a second side opposite the first side;
a second substrate film configured to accommodate electrical features on at least a first side thereof, the second substrate film having the first side and a second side opposite the first side, the first sides of the first and second substrate films being configured to face each other;
at least one electrical feature on the first side of the first substrate film;
at least one other electrical feature on the first side of the second substrate film, wherein at least one of the at least one electrical feature or the at least one other electrical feature is a mounted electronic component; and
a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof, wherein one of the at least one electrical feature on the first substrate film comprises a first sensing element for detecting touch on the assembly surface.

2. The assembly of claim 1 , wherein the first sensing element comprises a first electrode.

3. The assembly of claim 1 , wherein one of the at least one other electrical feature on the second substrate film comprises a second sensing element, the first and second sensing elements being collectively configured to detect touch or gesture.

4. The assembly of claim 3 , wherein the second sensing element comprises a second electrode.

5. The assembly of claim 1 , further comprising at least one protective layer on at least one of the first or second substrate films.

6. The assembly of claim 1 , wherein at least one of the first or second substrate films comprises a window of optically opaque, translucent, or transparent material having regard to a predetermined frequency or frequency band.

7. The assembly of claim 1 , wherein at least one of the first or second substrate films comprises a window of through-hole type with no fill material.

8. The assembly of claim 1 , wherein the substrate film includes at least one material selected from the group consisting of: polymer, thermoplastic material, PMMA (Polymethyl methacrylate), Poly Carbonate (PC), polyimide, a copolymer of Methyl Methacrylate and Styrene (MS resin), glass, organic material, fibrous material, Polyethylene Terephthalate (PET), and metal.

9. The assembly of claim 1 , wherein the molded plastic layer includes at least one material selected from the group consisting of: PC, PMMA, ABS, PET, nylon (PA, polyamide), polypropylene (PP), polystyrene (GPPS), elastomeric resin, and MS resin.

10. The assembly of claim 1 , wherein the electrical features located on the first or second substrate film comprise at least one element selected from the group consisting of: conductive trace, printed conductive trace, contact pad, component, integrated circuit (chip), processing unit, memory, communication unit, transceiver, transmitter, receiver, signal processor, microcontroller, battery, light emitting device, light sensing device, photodiode, connector, electrical connector, optical connector, diode, OLED (Organic LED), printed electronic component, sensor, force sensor, antenna, accelerometer, gyroscope, capacitive switch or sensor, electrode, sensor electrode, printed sensor electrode, and photovoltaic cell.

11. A method of establishing an integrated multilayer assembly for an electronic device comprising:
obtaining a first substrate film configured to accommodate electrical features on at least a first side thereof, the first substrate film having the first side and a second side opposite the first side;
obtaining a second substrate film configured to accommodate electrical features on at least a first side thereof, the second substrate film having the first side and a second side opposite the first side;
providing at least one electrical feature on the first side of the first substrate film;
providing at least one other electrical feature on the first side of the second substrate film, wherein at least one of the at least one electrical feature or the at least one other electrical feature is a mounted electronic component;
forming at least one of the first or second substrates into a selected substantially non-planar three-dimensional shape subsequent to providing the at least one electrical feature thereon;
arranging the first and second substrate films in a mold so that the first sides thereof face each other in spaced relation; and
molding a plastic layer between the first and second substrate films and at least partially embedding the electrical features on the first sides thereof.

12. The method of claim 11 , wherein the provision of the at least one electrical feature comprises mounting or additively printing a first sensing element.

13. The method of claim 12 , wherein the first sensing element comprises a first electrode for sensing touch or gesture upon the assembly.

14. The method of claim 13 , wherein the first substrate film is configured as a front film, when in use, facing the environment and potential objects to be sensed therein.

15. The method of claim 12 , wherein the provision of the at least one other electrical feature comprises mounting or additively printing a second sensing element.

16. The method of claim 15 , wherein the second sensing element comprises a second electrode for sensing touch or gesture upon the assembly in combination with the first sensing element.

17. The method of claim 16 , wherein the first and second sensing elements are spatially configured to overlap in the thickness direction of the assembly.

Assignees

• Tactotek Oy

Inventors

• Sääski Jarmo
• Torvinen Jarkko
• Raappana Pasi
• Heikkinen Mikko

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• B32B17/06

  comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• B32B15/082

  comprising vinyl resins; comprising acrylic resins · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title