Grinding wheel and grinding apparatus

Patent metadata

Field	Value
Publication number	US-10639761-B2
Application number	US-201715708277-A
Country	US
Kind code	B2
Filing date	Sep 19, 2017
Priority date	Sep 20, 2016
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.

First claim

What is claimed is:

1. A grinding wheel for grinding a wafer held on a holding table by transmitting an ultrasonic vibration to a plurality of grindstones arranged in an annular pattern, the grinding wheel comprising:
a first circular annular plate having an annular mounted surface to be mounted to a mount of a grinding apparatus;
a tubular body extending downward from an outer circumference of the first circular annular plate;
a second circular annular plate connected to a lower end of the tubular body and having an opening in a center;
the plurality of grindstones arranged in the annular pattern on a lower surface of the second circular annular plate;
an annular ultrasonic oscillation section for transmitting ultrasonic vibration to the grindstones, disposed on an upper surface of the second circular annular plate so as to surround the opening; and
an ultrasonic reception section for receiving the ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones, the ultrasonic reception section being disposed on the upper surface of the second circular annular plate,
wherein said ultrasonic reception section is disposed radially outwardly of said annular ultrasonic oscillation section.

2. The grinding wheel according to claim 1 , wherein said ultrasonic reception section is configured to be rotated with the grinding wheel.

3. A grinding apparatus comprising:
a holding table that holds a wafer by a holding surface;
a grinding unit for grinding the wafer held by the holding table, the grinding unit having a mount to which a grinding wheel is mounted rotatably; and
a grinding feeding unit for grinding feed of the grinding unit in a vertical direction relative to the holding surface,
wherein the grinding wheel includes:
a first circular annular plate having an annular mounted surface to be mounted to a mount of a grinding apparatus;
a tubular body extending downward from an outer circumference of the first circular annular plate;
a second circular annular plate connected to a lower end of the tubular body and having an opening in a center;
a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate;
an annular ultrasonic oscillation section transmitting ultrasonic vibration to the grindstones, disposed on an upper surface of the second circular annular plate so as to surround the opening; and
an ultrasonic reception section that receives the ultrasonic vibration transmitted from the ultrasonic oscillator to the grindstones, the ultrasonic reception section being disposed the upper surface of the second circular annular plate, and
the grinding apparatus further comprises:
a high-frequency power source that supplies high-frequency electric power to the ultrasonic oscillator section of the grinding wheel; and
a control unit that controls the electric power supplied from the high-frequency power source according to amplitude of the ultrasonic vibration that is oscillated by the ultrasonic oscillation section, is transmitted to the grindstones and is received by the ultrasonic reception section.

4. The grinding apparatus according to claim 3 , wherein the control unit is configured such that amplitude of the ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones is decreased when a touch of the grindstones on the wafer is strong and the amplitude is increased when the touch of the grindstones on the wafer is weak.

5. The grinding apparatus according to claim 3 , wherein said ultrasonic reception section is disposed radially outwardly of said annular ultrasonic oscillation section.

6. The grinding apparatus according to claim 3 , wherein said ultrasonic reception section is disposed radially inwardly of said annular ultrasonic oscillation section.

7. The grinding wheel according to claim 3 , wherein said ultrasonic reception section is configured to be rotated with the grinding wheel.

8. A grinding wheel for grinding a wafer held on a holding table by transmitting an ultrasonic vibration to a plurality of grindstones arranged in an annular pattern, the grinding wheel comprising:
a first circular annular plate having an annular mounted surface to be mounted to a mount of a grinding apparatus;
a tubular body extending downward from an outer circumference of the first circular annular plate;
a second circular annular plate connected to a lower end of the tubular body and having an opening in a center;
the plurality of grindstones arranged in the annular pattern on a lower surface of the second circular annular plate;
an annular ultrasonic oscillation section transmitting ultrasonic vibration to the grindstones, disposed on an upper surface of the second circular annular plate so as to surround the opening; and
an ultrasonic reception section for receiving the ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones, the ultrasonic reception section being disposed on the upper surface of the second circular annular plate,
wherein said ultrasonic reception section is disposed radially inwardly of said annular ultrasonic oscillation section.

9. The grinding wheel according to claim 8 , wherein said ultrasonic reception section is configured to be rotated with the grinding wheel.

Assignees

• Disco Corp

Inventors

• Qiu Xiaoming

Classifications

• B24B1/04 Primary

  subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00) · CPC title

• B24B41/0475

  equipped with oscillating abrasive blocks, e.g. mounted on a rotating head · CPC title

• B24B7/228 Primary

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B7/04

  involving a rotary work-table · CPC title

• B24B47/04

  by mechanical gearing only · CPC title