Planar heating device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10638546-B2
Application number	US-201715468451-A
Country	US
Kind code	B2
Filing date	Mar 24, 2017
Priority date	Aug 26, 2016
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

A planar heating device includes a substrate, first and second electrodes disposed on both ends of the substrate, a heating layer disposed on the substrate and configured to contact the first and second electrodes, a first additional heating layer disposed on one end of the heating layer, and a second additional heating layer disposed on the other end of the heating layer.

First claim

What is claimed is:

1. A planar heating device comprising:
a substrate;
a first electrode disposed on an end portion of the substrate;
a second electrode disposed on an opposing end portion of the substrate;
a heating layer disposed on the substrate and in contact with the first and second electrodes;
a first additional heating layer disposed on an end portion of the heating layer; and
a second additional heating layer disposed on an opposing end portion of the heating layer,
wherein the first additional heating layer is separated from the second additional heating layer.

2. The planar heating device of claim 1 , wherein
the first additional heating layer contacts the first electrode, and
the second additional heating layer contacts the second electrode.

3. The planar heating device of claim 1 , wherein
a resistance of each of a region of the heating layer, on which the first additional heating layer is disposed, and a region of the heating layer, on which the second additional heating layer is disposed, is lower than a resistance of a region of the heating layer, on which the first and second additional heating layers are not disposed.

4. The planar heating device of claim 1 , wherein
each of the heating layer, the first additional heating layer and the second additional heating layer comprises carbon nanotubes.

5. The planar heating device of claim 1 , wherein
each of the heating layer, the first additional heating layer and the second additional heating layer comprises a conductive oxide film,
wherein the conductive oxide film comprises at least one of RuO 2 , MnO 2 , VO 2 , TaO 2 , IrO 2 , NbO 2 , WO 2 , GaO 2 , MoO 2 , InO 2 , CrO 2 , and RhO 2 .

6. The planar heating device of claim 1 , wherein
a thickness of the heating layer is in a range of about 10 micrometers to about 100 micrometers, and
a thickness of each of the first and second additional heating layers is in a range of about 10 micrometers to about 100 micrometers.

7. The planar heating device of claim 6 , wherein
the thickness of each of the first and second additional heating layers is equal to or greater than the thickness of the heating layer.

8. The planar heating device of claim 7 , wherein
the thickness of each of the first and second additional heating layers is equal to or twice the thickness of the heating layer.

9. The planar heating device of claim 1 , wherein
a width of each of the first and second additional heating layers is in a range of about 10 millimeters to about 20 millimeters.

10. The planar heating device of claim 1 , wherein
each of the first and second electrodes comprises at least one of silver, aluminum, indium tin oxide, copper, molybdenum, and platinum.

11. A method of manufacturing a planar heating device, the method comprising:
preparing a substrate;
providing first and second electrodes on opposing end portions of the substrate, respectively;
providing a heating layer on the substrate in a way such that the heating layer contacts the first and second electrodes;
providing a first additional heating layer on an end portion of the heating layer; and
providing a second additional heating layer on an opposing end portion of the heating layer,
wherein the first additional heating layer is separated from the second additional heating layer.

12. The method of claim 11 , wherein
the first additional heating layer contacts the first electrode, and
the second additional heating layer contacts the second electrode.

13. The method of claim 11 , wherein
resistance of each of a region of the heading layer, on which the first additional heating layer is provided, and a region of the heading layer, on which the second additional heating layer is provided, is lower than resistance of a region of the heading layer on which the first and second additional heating layers are not provided.

14. The method of claim 11 , wherein
a thickness of the heating layer is in a range of about 10 micrometers to about 100 micrometers, and
a thickness of each of the first and second additional heating layers is in a range of about 10 micrometers to about 100 μm micrometers.

15. The method of claim 14 , wherein
the thickness of each of the first and second additional heating layers is equal to or greater than the thickness of the heating layer.

16. The method of claim 15 , wherein
the thickness of each of the first and second additional heating layers is equal to or twice the thickness of the heating layer.

17. The method of claim 11 , wherein
a width of each of the first and second additional heating layers is in a range of about 10 millimeters to about 20 millimeters.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Doyoon
• Koh Haengdeog
• Kim Seyun
• Kim Jinhong
• Kim Hajin
• Mizusaki Soichiro
• Bae Minjong
• Sohn Hiesang
• Lee Changsoo

Classifications

• H05B3/145

  Carbon only, e.g. carbon black, graphite · CPC title

• H05B2214/04

  Heating means manufactured by using nanotechnology · CPC title

• H05B3/34 Primary

  flexible, e.g. heating nets or webs · CPC title

• H05B3/26

  heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)} · CPC title

• H05B3/141 Primary

  Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds · CPC title