Closed loop temperature controlled circuit to improve device stability

Patent metadata

Field	Value
Publication number	US-9165853-B2
Application number	US-201414586231-A
Country	US
Kind code	B2
Filing date	Dec 30, 2014
Priority date	Oct 11, 2010
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

First claim

The invention claimed is:

1. A device comprising:
a first semiconductor die;
an active circuit in the first semiconductor die;
a temperature sensor configured to measure a temperature of the active circuit;
a second semiconductor die coupled to the first semiconductor die;
a heating element on the second semiconductor die, the heating element configured to heat the active circuit of the first semiconductor die; and
a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, to operate the heating element according to the temperature data and the level of use of the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit above a minimum threshold temperature and below a maximum threshold temperature.

2. The device of claim 1 wherein the temperature controller is in the second semiconductor die.

3. The device of claim 1 wherein the temperature controller is in the first semiconductor die.

4. The device of claim 1 wherein the temperature controller regulates a current in the heating element to generate heat to maintain the temperature of the active circuit above the minimum threshold temperature and below the maximum threshold temperature.

5. The device of claim 1 wherein the temperature sensor is on the second semiconductor die.

6. The device of claim 1 wherein the temperature sensor is on the first semiconductor die.

7. The device of claim 1 wherein the temperature sensor is a thin film resistor whose resistance varies with temperature.

8. The device of claim 1 wherein the temperature sensor and the temperature controller are in the second semiconductor die.

9. The device of claim 1 wherein the temperature sensor and the temperature controller are in the first semiconductor die.

10. The device of claim 1 wherein the heating element is a thin film heating element.

11. The device of claim 10 wherein the heating element is TaAl.

12. The device of claim 10 comprising a multilayer dielectric stack on a surface of the second semiconductor die, the thin film heating element being located in the multilayer dielectric stack.

13. The device of claim 12 wherein the heating element is located above the active circuit.

14. The device of claim 1 wherein the heating element is a single heating element with a variable heat output.

15. The device of claim 1 wherein the heating element is a plurality of heating elements, and the temperature controller selectively enables a number of the heating elements based on the temperature data.

16. A device comprising:
a first semiconductor die;
an active circuit in the first semiconductor die;
a temperature sensor configured to measure a temperature of the active circuit;
a second semiconductor die coupled to the first semiconductor die;
a heating element on the second semiconductor die, the heating element configured to heat the active circuit of the first semiconductor die;
a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, to operate the heating element according to the temperature data and the level of use of the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit above a minimum threshold temperature and below a maximum threshold temperature; and
a multilayer dielectric stack on a surface of the second semiconductor die, the heating element being located in the multilayer dielectric stack.

17. The device of claim 16 wherein the heating element is a thin-film heating element.

18. A device comprising:
a first semiconductor die;
an active circuit in the first semiconductor die;
a temperature sensor configured to measure a temperature of the active circuit;
a second semiconductor die coupled to the first semiconductor die;
a plurality of heating elements on the second semiconductor die, the heating elements configured to heat the active circuit of the first semiconductor die; and
a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, to operate the heating element according to the temperature data and the level of use of the active circuit, and to selectively enable a number of the heating elements based on the temperature data.

19. The device of claim 18 wherein the heating element is a thin-film heating element.

20. The device of claim 19 wherein the temperature sensor is a thin film resistor whose resistance varies with temperature.

Assignees

• St Microelectronics Asia
• St Microelectronics Inc
• St Microelectronics Asia

Inventors

• Wang Fuchao
• Leneel Olivier
• Shankar Ravi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title