Apparatus for spatial and temporal control of temperature on a substrate

Patent metadata

Field	Value
Publication number	US-10636689-B2
Application number	US-201414340083-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Dec 30, 2004
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.

First claim

What is claimed is:

1. A substrate support for control of a temperature of a semiconductor substrate supported thereon during plasma processing of the semiconductor substrate comprising:
a temperature-controlled base having a top surface;
a metal plate;
a film heater, the film heater being a thin and flexible polyimide heater film with a plurality of independently controlled resistive heating elements thermally coupled to an underside of the metal plate, the film heater being electrically insulated from the metal plate, and the metal plate having a thickness adequate to transfer a spatial pattern of the film heater to the semiconductor substrate;
a first layer of adhesive bonding the metal plate and the film heater to the top surface of the temperature-controlled base; and
a layer of dielectric material bonded to a top surface of the metal plate with a second layer of adhesive, the layer of dielectric material forming an electrostatic clamping mechanism for supporting the semiconductor substrate.

2. The substrate support of claim 1 wherein the top surface of the temperature-controlled base is flat to within about 0.0005 inch.

3. The substrate support of claim 1 wherein a surface dimension of the metal plate is substantially similar to the surface dimension of the temperature-controlled base.

4. The substrate support of claim 1 wherein the metal plate also has a bottom surface, the top and bottom surfaces being substantially parallel to each other to within about 0.0005 inch.

5. The substrate support of claim 1 wherein the resistive heating elements form a pattern layout.

6. The substrate support of claim 1 wherein the first layer of adhesive includes a uniformly deposited mechanically flexible thermal insulator layer having a thickness of about 0.013 to about 0.040 inch with thickness variation within 0.001 inch.

7. The substrate support of claim 1 wherein the first layer of adhesive includes a solid plate.

8. The substrate support of claim 7 wherein the solid plate includes top and bottom surfaces, the top and bottom surfaces being substantially parallel to each other to within about 0.001 inch.

9. The substrate support of claim 7 wherein a thermal conductivity of the solid plate is based on relative power levels employed by the film heater and an external process.

10. The substrate support of claim 7 wherein the solid plate includes top and bottom surfaces, and wherein the bottom surface of the solid plate is bonded to the top surface of the temperature-controlled base with a mechanically flexible adhesive having a substantially high thermal conductivity.

11. The substrate support of claim 7 wherein the top surface of the solid plate is bonded to the underside of the metal plate with a mechanically flexible adhesive having a substantially high thermal conductivity.

12. The substrate support of claim 1 further comprising an electrical connector having:
a vertical spring loaded pin having a top end, the vertical spring loaded pin disposed in a cavity of the temperature-controlled base, the first layer of adhesive, and the film heater; and
a bushing configured to enclose a portion of the top end of the pin, the bushing being thermally conductive and thermally coupled to the film heater and the layer of dielectric material, the bushing being electrically non-conductive.

13. The substrate support of claim 12 further comprising a socket configured to hold a bottom end of said pin.

14. The substrate support of claim 13 further comprising a plastic insulator cover configured to cover the socket and a portion of the pin, exposing the top end of the pin.

15. The substrate support of claim 14 wherein the bushing is configured to electrically insulate the top end of the pin from a wall of the cavity in the temperature-controlled base and to transfer an amount of heat from the film heater to the layer of dielectric material.

16. A plasma etching system comprising:
a chamber having the substrate support of claim 1 ; and
a power supply.

17. The plasma etching system of claim 16 further comprising:
a temperature probe coupled to the metal plate; and
a feedback controller coupled to the temperature probe and the power supply.

18. The plasma etching system of claim 16 further comprising an electrical connector having:
a vertical spring loaded pin having a top end in contact with the electrostatic clamping mechanism in the layer of dielectric material, the vertical spring loaded pin disposed in a cavity of the temperature-controlled base, the first layer of adhesive, and the film heater; and
a bushing enclosing a portion of the top end of the pin, the bushing thermally coupled to the film heater and the bushing being electrically non-conductive.

Assignees

• Lam Res Corp

Inventors

• Ricci Anthony J
• Comendant Keith
• Tappan James

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H01J2237/20

  Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated · CPC title