Surface-modified inorganic substance, method for manufacturing same, resin composition, thermally conductive material, and device

Patent metadata

Field	Value
Publication number	US-10633252-B2
Application number	US-201816045714-A
Country	US
Kind code	B2
Filing date	Jul 25, 2018
Priority date	Jan 26, 2016
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

In the formula, ZZ represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, and a (meth)acrylate group, and XX represents a divalent linking group.

First claim

What is claimed is:

1. A surface-modified inorganic substance obtained by performing surface modification on an inorganic nitride by using an aldehyde compound, wherein the inorganic nitride includes aluminum, or the inorganic nitride is boron nitride,
wherein the aldehyde compound is a compound represented by General Formula I;
Z Z —X X —CHO  General Formula I

in the General Formula I, Z Z represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, and a (meth)acrylate group, and X X represents a divalent linking group.

2. The surface-modified inorganic substance according to claim 1 ,
wherein the aldehyde compound has a structure including two or more non-fused monocyclic aromatic rings or a fused ring in which three or more monocyclic aromatic rings are fused.

3. The surface-modified inorganic substance according to claim 2 ,
wherein the aldehyde compound has a structure including a fused ring in which three or more monocyclic aromatic rings are fused.

4. The surface-modified inorganic substance according to claim 1
wherein the inorganic nitride is aluminum nitride.

5. The surface-modified inorganic substance according to claim 1 ,
wherein the surface modification is modification based on the formation of a covalent bond that the aldehyde compound forms with a surface of the inorganic nitride.

6. A thermally conductive material comprising:
the surface-modified inorganic substance according to claim 1 .

7. A sheet consisting of the thermally conductive material according to claim 6 .

8. The sheet according to claim 7 , wherein the sheet is a heat dissipation sheet.

9. A device comprising:
the thermally conductive material according to claim 6 .

10. A lubricant comprising:
the surface-modified inorganic substance according to claim 1 .

11. A method for manufacturing the surface-modified inorganic substance according to claim 1 , comprising:
making a contact between the aldehyde compound and the inorganic nitride.

12. The manufacturing method according to claim 11 ,
wherein the contact is made by stirring a solution containing the inorganic nitride and the aldehyde compound.

13. The manufacturing method according to claim 12 ,
wherein a solvent of the solution is ethyl acetate, methyl ethyl ketone, or dichloromethane.

14. A resin composition comprising:
a surface-modified inorganic substance obtained by performing surface modification on an inorganic nitride by using an aldehyde compound, wherein the inorganic nitride includes aluminum, or the inorganic nitride is boron nitride; and
a monomer having a group selected from the group consisting of an oxetanyl group, an oxiranyl group, and a (meth)acrylate group,
wherein the aldehyde compound is a compound represented by General Formula I;
Z Z —X X —CHO  General Formula I

in the General Formula I, Z Z represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, and a (meth)acrylate group, and X X represents a divalent linking group.

15. The resin composition according to claim 14 ,
wherein the monomer has an oxiranyl group.

16. The resin composition according to claim 15 ,
wherein in the General Formula I, Z Z represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group.

17. The resin composition according to claim 15 , further comprising:
a curing agent having a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group.

18. The resin composition according to claim 17 ,
wherein in the General Formula I, Z Z represents an oxiranyl group.

19. A thermally conductive material comprising:
a cured substance of the resin composition according to claim 14 .

Assignees

• Fujifilm Corp

Inventors

• Hitomi Seiichi
• Takahashi Keita

Classifications

• C01B21/0687

  After-treatment, e.g. grinding, purification · CPC title

• C01B21/0648 Primary

  After-treatment, e.g. grinding, purification (transformation of hexagonal into cubic or wurtzitic boron nitride C04B35/5831) · CPC title

• C01B21/0728

  After-treatment, e.g. grinding, purification · CPC title

• C01B21/06

  Binary compounds of nitrogen with metals, with silicon, or with boron, {or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron}(azides C01B21/08) · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title