Light emitting device and production method thereof

Patent metadata

Field	Value
Publication number	US-10629776-B2
Application number	US-201916285438-A
Country	US
Kind code	B2
Filing date	Feb 26, 2019
Priority date	Aug 30, 2016
Publication date	Apr 21, 2020
Grant date	Apr 21, 2020

Abstract

A light emitting device includes a substrate, a light emitting unit disposed on the substrate, a metallic electrode unit, a metallic adhesion layer disposed on the first and second electrodes of the electrode unit, and a protective layer disposed on the adhesion layer. The first electrode is disposed on a portion of a first-type semiconductor layer of the light emitting unit. The second electrode is disposed on a second-type semiconductor layer of the light emitting unit disposed on a separated portion of the first-type semiconductor layer. The first and second electrodes are partially exposed by the protective layer and the adhesion layer that is partially exposed by the protective layer. A production method for the light emitting device is also disclosed.

First claim

What is claimed is:

1. A light emitting device comprising:
a substrate;
a light emitting unit disposed on said substrate, and including a first-type semiconductor layer, a light emitting layer, and a second-type semiconductor layer which are sequentially arranged from bottom to top, said first-type semiconductor layer being partially overlaid by said light emitting layer and said second-type semiconductor layer;
a metallic electrode unit including a first metallic multilayer electrode and a second metallic multilayer electrode, said first metallic multilayer electrode being disposed on a first placement portion of said first-type semiconductor layer which is not overlaid by said light emitting layer and said second-type semiconductor layer, said light emitting layer and said second-type semiconductor layer being disposed on a second placement portion of said first-type semiconductor layer to overlay said first-type semiconductor layer, said first and second placement portions of said first-type semiconductor layer being separated by a spacer portion of said first-type semiconductor layer, said second metallic multilayer electrode being disposed on said second-type semiconductor layer;
a metallic adhesion layer disposed on said first and second metallic multilayer electrodes; and
a protective layer disposed on said metallic adhesion layer,
wherein each of said first and second metallic multilayer electrodes is partially exposed by said metallic adhesion layer and said protective layer, said metallic adhesion layer being partially exposed by said protective layer on each of the first and second metallic multilayer electrodes,
wherein said first-type semiconductor layer extends from a top surface of said substrate to terminate at an upper surface that has said first and second placement portions and said spacer portion, said light emitting layer extending from said second placement portion of said upper surface of said first-type semiconductor layer to terminate at an upward surface, said second-type semiconductor layer extending from said upward surface of said light emitting layer to terminate at an upper surface on which said second metallic multilayer electrode is disposed,
wherein said metallic adhesion layer is disposed over said first and second metallic multilayer electrodes, and has two first through-holes that partially expose a top electrode surface of said first metallic multilayer electrode and a top electrode surface of said second metallic multilayer electrode, respectively, and
wherein said protective layer is disposed over said metallic adhesion layer, and has two second through-holes that are in spatial communication with said first through-holes, respectively, said second through-holes partially exposing said top electrode surface of said first metallic multilayer electrode and said top electrode surface of said second metallic multilayer electrode, respectively, said second through-holes being larger in size than said first through-holes, respectively, so that said second through-holes partially expose said metallic adhesion layer.

2. The light emitting device as claimed in claim 1 , wherein an exposed part of said top electrode surface of said first metallic multilayer electrode, which is exposed by a respective one of said first through-holes and a respective one of said second through-holes, and an exposed part of said top electrode surface of said second metallic multilayer electrode, which is exposed by a respective one of said first through-holes and a respective one of said second through-holes, are each adapted to be connected to a bonding wire, adhesion between said metallic adhesion layer and said first metallic multilayer electrode being stronger than that between said metallic adhesion layer and the bonding wire, adhesion between said metallic adhesion layer and said second metallic multilayer electrode being stronger than that between said metallic adhesion layer and the bonding wire.

3. The light emitting device as claimed in claim 1 , wherein said metallic adhesion layer is made from a material selected from the group consisting of Ti, TiN, Cr, Ni, and combinations thereof.

4. The light emitting device as claimed in claim 1 , wherein said first metallic multilayer electrode includes a first bottom layer that is disposed on said first placement portion of said first-type semiconductor layer, and a first top layer that is disposed over said first bottom layer and has said top electrode surface of said first metallic multilayer electrode, said second metallic multilayer electrode including a second bottom layer that is disposed on said upper surface of said second-type semiconductor layer, and a second top layer that is disposed over said second bottom layer and has said top electrode surface of said second metallic multilayer electrode, said first top layer of said first metallic multilayer electrode and said second top layer of said second metallic multilayer electrode each being made from Pt.

5. The light emitting device as claimed in claim 1 , wherein one of said first-type semiconductor layer and said second-type semiconductor layer is an n-type semiconductor layer, and the other one of said first-type semiconductor layer and said second-type semiconductor layer is a p-type semiconductor layer.

6. The light emitting device as claimed in claim 1 , wherein each of said first-type semiconductor layer, said light emitting layer, and said second-type semiconductor layer is made from a GaN-based semiconductor material.

7. The light emitting device as claimed in claim 1 , wherein said protective layer is made from a material selected from the group consisting of SiO 2 , Si 3 N 4 , Al 2 O 3 , TiO 2 , and combinations thereof.

8. A light emitting device comprising:
a substrate;
a light emitting unit disposed on said substrate, and including a first-type semiconductor layer, a light emitting layer, and a second-type semiconductor layer which are sequentially arranged from bottom to top, said first-type semiconductor layer being partially overlaid by said light emitting layer and said second-type semiconductor layer;
a metallic electrode unit including a first metallic multilayer electrode and a second metallic multilayer electrode, said first metallic multilayer electrode being disposed on a first placement portion of said first-type semiconductor layer which is not overlaid by said light emitting layer and said second-type semiconductor layer, said light emitting layer and said second-type semiconductor layer being disposed on a second placement portion of said first-type semiconductor layer to overlay said first-type semiconductor layer, said first and second placement portions of said first-type semiconductor layer being separated by a spacer portion of said first-type semiconductor layer, said second metallic multilayer electrode being disposed on said second-type semiconductor layer;
a metallic adhesion layer disposed on said first and second metallic multilayer electrodes; and
a protective layer disposed on said metallic adhesion layer,
wherein each of said first and second metallic multilayer electrodes is partially exposed by said metallic adhesion layer and said protective layer, said metallic adhesion layer being partially exposed by said protective layer on each of the first and second metallic multilayer electrodes,
wherein said first-type semiconductor layer extends from a top surface of said substrate to terminate at an upper surface that has said first and second placement portions and said spacer portion, said light emitting layer extending from said second placement portion of said upper surface of said first-type semiconductor layer to terminate at an upward surface, said second-type semiconductor layer extending from

Assignees

• Xiamen Sanan Optoelectronics Co Ltd
• Xiamen San An Optoelectronics Co Ltd

Inventors

• He Anhe
• Lin Su-Hui
• Peng Kang-Wei
• Hong ling-yuan
• Huang Yu-Chieh
• Xia Zhanggen

Classifications

• H01L33/40

  Electricity · mapped topic

• H01L33/36 Primary

  Electricity · mapped topic

• H01L33/007

  Electricity · mapped topic

• H01L33/62

  Electricity · mapped topic

• H01L2933/0016

  Electricity · mapped topic