Electronic component and electronic unit

Patent metadata

Field	Value
Publication number	US-9595646-B2
Application number	US-201414564521-A
Country	US
Kind code	B2
Filing date	Dec 9, 2014
Priority date	Jul 31, 2014
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

According to one embodiment, an electronic component includes a metal portion, a mold resin covering at least a part of the metal portion, and a molecular adhesion layer provided between a surface of the metal portion and the mold resin.

First claim

What is claimed is:

1. An electronic component comprising:
a semiconductor device;
a metal electrode provided on and electrically connected to the semiconductor device;
a mold resin provided in a periphery of the metal electrode, the mold resin covering at least a part of the semiconductor device and at least a part of the metal electrode; and
a molecular adhesion layer provided between a surface of the metal electrode and the mold resin,
wherein the semiconductor device comprises a first surface and a second surface located on an opposite side to the first surface, the second surface being provided with the metal electrode,
wherein the mold resin covers the second surface of the semiconductor device,
wherein the molecular adhesion layer is provided between the second surface of the semiconductor device and the mold resin,
wherein the molecular adhesion layer makes the surface of the metal electrode and the mold resin adhere to each other by a chemical bond, and the molecular adhesion layer makes the second surface of the semiconductor device and the mold resin adhere to each other by a chemical bond, and
wherein the molecular adhesion layer comprises a triazine dithiol residue.

2. The electronic component of claim 1 ,
wherein the semiconductor device is a light-emitting device.

3. The electronic component of claim 1 further comprising a fluorescent layer,
wherein the fluorescent layer covers the first surface of the semiconductor device.

4. The electronic component of claim 3 ,
wherein the metal electrode projects in a substantially orthogonal direction to the second surface and comprises a peripheral surface extending in a projecting direction of the metal electrode,
the mold resin covers the peripheral surface of the metal electrode, and
the molecular adhesion layer is provided between the peripheral surface of the metal electrode and the mold resin.

5. The electronic component of claim 4 ,
wherein the molecular adhesion layer comprises a first portion provided between the peripheral surface of the metal electrode and the mold resin and a second portion provided between the second surface of the semiconductor device and the mold resin, and the first portion and the second portion are continuously formed.

6. The electronic component of claim 3 ,
wherein the semiconductor device comprises a side surface connecting an edge of the first surface and an edge of the second surface,
the mold resin covers the side surface of the semiconductor device, and
the molecular adhesion layer is provided also between the side surface of the semiconductor device and the mold resin.

7. The electronic component of claim 3 ,
wherein the semiconductor device comprises a first portion having a first thickness, a second portion having a second thickness, and a step portion located between the first portion and the second portion,
the mold resin covers the step portion, and
the molecular adhesion layer is provided also between a surface of the step portion and the mold resin.

8. The electronic component of claim 1 ,
wherein the electronic component is a wafer level package.

9. The electronic component of claim 1 ,
wherein the metal electrode comprises an exposed surface, and
wherein the molecular adhesion layer is not provided on the exposed surface of the metal electrode.

10. The electronic component of claim 1 ,
wherein the semiconductor device comprises a first portion having a first thickness and a second portion having a second thickness, and
wherein the first thickness is less than the second thickness.

11. An electronic component comprising:
a metal portion provided on and electrically connected to the electronic component;
a mold resin covering at least a part of the metal portion;
a molecular adhesion layer provided between a surface of the metal portion and the mold resin;
a first surface; and
a second surface located on an opposite side to the first surface, the second surface being provided with the metal portion,
wherein the mold resin covers the second surface,
wherein the molecular adhesion layer is provided between the second surface and the mold resin,
wherein the molecular adhesion layer makes the surface of the metal portion and the mold resin adhere to each other by a chemical bond, and the molecular adhesion layer makes the second surface of the electronic component and the mold resin adhere to each other by a chemical bond, and
wherein the molecular adhesion layer comprises a triazine dithiol residue.

12. The electronic component of claim 11 further comprising a component main body provided with the metal portion,
wherein the mold resin covers at least a part of the component main body, and
the molecular adhesion layer is provided also between a surface of the component main body and the mold resin.

13. The electronic component of claim 11 ,
wherein the metal portion comprises an exposed surface, and
wherein the molecular adhesion layer is not provided on the exposed surface of the metal portion.

14. An electronic unit comprising:
a component;
a resin portion covering at least a part of the component;
a molecular adhesion layer provided between a surface of the component and the resin portion; and
a circuit board on which the component is mounted,
wherein the component comprises a solder ball that is electrically connected to the component and is connected to the circuit board,
wherein the molecular adhesion layer is provided between a surface of the solder ball and the resin portion,
wherein the molecular adhesion layer makes the surface of the component and the resin portion adhere to each other by a chemical bond, and the molecular adhesion layer makes the solder ball and the resin portion adhere to each other by a chemical bond, and
wherein the molecular adhesion layer comprises a triazine dithiol residue.

15. The electronic unit of claim 14 wherein the resin portion is an underfill provided between the circuit board and the component and surrounding the solder ball.

16. The electronic unit of claim 15 ,
wherein the component comprises a side surface,
the underfill comprises a fillet covering at least a part of the side surface of the component, and
the molecular adhesion layer is provided also between the side surface of the component and the fillet.

17. The electronic component of claim 14 ,
wherein the circuit board comprises a surface connected to the component, and
wherein the molecular adhesion layer is not provided on the surface connected to the component.

Assignees

• Toshiba Kk

Inventors

• Happoya Akihiko
• Suzuki Daigo

Classifications

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/014

  using batch processing · CPC title