Amplifiers and amplifier modules with ground plane height variation structures

Patent metadata

Field	Value
Publication number	US-10629552-B2
Application number	US-201815967102-A
Country	US
Kind code	B2
Filing date	Apr 30, 2018
Priority date	Apr 30, 2018
Publication date	Apr 21, 2020
Grant date	Apr 21, 2020

Abstract

An embodiment of a module (e.g., an amplifier module) includes a substrate, a transmission line, and a ground plane height variation structure. The substrate is formed from a plurality of dielectric material layers, and has a mounting surface and a second surface opposite the mounting surface. A plurality of non-overlapping zones is defined at the mounting surface. The transmission line is coupled to the substrate and is located within a first zone of the plurality of non-overlapping zones. The ground plane height variation structure extends from the second surface into the substrate within the first zone. The ground plane height variation structure underlies the transmission line, a portion of the substrate is present between the upper boundary and the transmission line, and the ground plane height variation structure includes a conductive path between an upper boundary of the ground plane height variation structure and the second surface.

First claim

What is claimed is:

1. A module comprising:
a substrate formed from a plurality of dielectric material layers, and having a mounting surface and a second surface opposite the mounting surface, wherein a plurality of non-overlapping zones is defined at the mounting surface;
first and second power transistors coupled to the substrate;
a transmission line coupled to the substrate and located within a first zone of the plurality of non-overlapping zones, wherein the transmission line is electrically coupled between the first and second power transistors; and
a ground plane height variation structure extending from the second surface into the substrate within the first zone, wherein the ground plane height variation structure underlies the transmission line, a portion of the substrate is present between an upper boundary of the ground plane height variation structure and the transmission line, and the ground plane height variation structure includes a conductive path between the upper boundary of the ground plane height variation structure and the second surface.

2. The module of claim 1 , wherein the ground plane height variation structure comprises:
a plurality of conductive vias within the first zone and extending from the second surface into the substrate.

3. The module of claim 2 , wherein the ground plane height variation structure further comprises:
a conductive plane embedded within the substrate and defining the upper boundary, wherein the conductive vias have first ends that are co-planar with the second surface, and second ends connected to the conductive plane.

4. The module of claim 1 , wherein the ground plane height variation structure comprises:
a plurality of conductive trenches within the first zone and extending from the second surface into the substrate.

5. The module of claim 4 , wherein the ground plane height variation structure further comprises:
a conductive plane embedded within the substrate and defining the upper boundary, wherein the conductive trenches have first ends that are co-planar with the second surface, and second ends connected to the conductive plane.

6. The module of claim 1 , wherein the ground plane height variation structure comprises:
a solid conductive structure disposed in a cavity within the substrate.

7. The module of claim 1 , wherein the ground plane height variation structure comprises:
a hollow conductive structure that includes a first conductive layer disposed on a top interior wall of a cavity within the substrate, and a second conductive layer disposed on an interior sidewall of the cavity.

8. The module of claim 1 , wherein a height of the ground plane variation structure is at least half of a total thickness of the substrate.

9. The module of claim 1 , wherein a height of the ground plane variation structure is more than half of a total thickness of the substrate.

10. A power amplifier module comprising:
a substrate formed from a plurality of dielectric material layers, and having a mounting surface and a second surface opposite the mounting surface, wherein a plurality of non-overlapping zones is defined at the mounting surface;
a first power transistor die coupled to the mounting surface in a first zone of the plurality of non-overlapping zones, wherein the first power transistor die includes a first transistor integrated within the first power transistor die, and wherein the first transistor includes a first output terminal;
a second power transistor die coupled to the mounting surface in a second zone of the plurality of non-overlapping zones, wherein the second power transistor die includes a second transistor integrated within the second power transistor die, and wherein the second transistor includes a second output terminal;
a first transmission line coupled to the substrate and located within a third zone of the plurality of non-overlapping zones, wherein a first end of the first transmission line is coupled to the first output terminal, and a second end of the first transmission line is coupled to the second output terminal; and
a ground plane height variation structure extending from the second surface of the substrate into the substrate within the third zone, wherein the ground plane height variation structure underlies the first transmission line, the ground plane height variation structure includes a conductive path between an upper boundary of the ground plane height variation structure and the second surface, and a portion of the substrate is present between the upper boundary and the first transmission line.

11. The amplifier module of claim 10 , further comprising:
a second transmission line coupled to the substrate and located within a fourth zone of the plurality of non-overlapping zones, wherein the ground plane height variation structure does not underlie the second transmission line.

12. The amplifier module of claim 10 , further comprising:
first wirebonds connected between the first output terminal and the first end of the first transmission line; and
second wirebonds connected between the second output terminal and the second end of the first transmission line, and
wherein the first transmission line, the first wirebonds, and the second wirebonds form portions of a phase delay and impedance inversion element, and wherein the phase shift and impedance inversion element has an electrical length that is less than 90 degrees.

13. The amplifier module of claim 10 , wherein the ground plane height variation structure comprises:
a plurality of conductive vias within the third zone and extending from the second surface into the substrate; and
a conductive plane embedded within the substrate and defining the upper boundary, wherein the conductive vias have first ends that are co-planar with the second surface, and second ends connected to the conductive plane.

14. The amplifier module of claim 10 , wherein the ground plane height variation structure comprises:
a plurality of conductive trenches within the third zone and extending from the second surface into the substrate; and
a conductive plane embedded within the substrate and defining the upper boundary, wherein the conductive trenches have first ends that are co-planar with the second surface, and second ends connected to the conductive plane.

15. The amplifier module of claim 10 , wherein the ground plane height variation structure comprises:
a solid conductive structure disposed in a cavity within the substrate.

16. The amplifier module of claim 10 , wherein the ground plane height variation structure comprises:
a hollow conductive structure that includes a first conductive layer disposed on a top interior wall of a cavity within the substrate, and a second conductive layer disposed on an interior sidewall of the cavity.

17. The amplifier module of claim 10 , wherein the first power transistor die is a carrier amplifier die of a Doherty power amplifier, and the second power transistor die is a peaking amplifier die of a Doherty power amplifier.

18. A Doherty amplifier comprising:
a substrate formed from a plurality of dielectric material layers, and having a mounting surface and a second surface opposite the mounting surface, wherein a plurality of non-overlapping zones is defined at the mounting surface;
a carrier amplifier die coupled to the mounting surface, wherein the carrier amplifier die includes a first transistor with a first drain terminal;
a peaking amplifier die coupled to the mounting surface, wherein the peaking amplifier die includes a second transistor with a second drain termi

Assignees

• Nxp Usa Inc

Inventors

• Wu Yu-Ting David
• Krvavac Enver
• Jones Jeffrey Kevin

Classifications

• H03F3/211

  using a combination of several amplifiers (H03F3/60 takes precedence) · CPC title

• H03F2200/255

  Amplifier input adaptation especially for transmission line coupling purposes, e.g. impedance adaptation · CPC title

• H03F1/0288 Primary

  using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers · CPC title

• H03F1/565

  using inductive elements · CPC title

• H03F3/213

  in integrated circuits · CPC title