Leadframe and semiconductor device
US-2024421050-A1 · Dec 19, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/73 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 10,419 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 287 |
| 2016 | 586 |
| 2017 | 700 |
| 2018 | 701 |
| 2019 | 871 |
| 2020 | 1,009 |
| 2021 | 790 |
| 2022 | 766 |
| 2023 | 1,066 |
| 2024 | 1,529 |
| 2025 | 1,785 |
| 2026 | 329 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package
US-2024404970-A1 · Dec 5, 2024 · US
Structure to reduce chip shift during assembly
US-2024395758-A1 · Nov 28, 2024 · US
Flip-chip mounting structure and flip-chip mounting method
US-2024387444-A1 · Nov 21, 2024 · US
Biometric sensor module for a smart card and method for manufacturing such a module
US-12131987-B2 · Oct 29, 2024 · US
Semiconductor package
US-2024355796-A1 · Oct 24, 2024 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2024332150-A1 · Oct 3, 2024 · US
Packages with electrical fuses
US-2024332243-A1 · Oct 3, 2024 · US
Semiconductor package
US-2024297150-A1 · Sep 5, 2024 · US
Semiconductor device
US-2024282677-A1 · Aug 22, 2024 · US
Frame member with a porous material between a semiconductor module and heat sink
US-12068217-B2 · Aug 20, 2024 · US
Power leadframe package with lead sidewall surface that is fully solder wettable
US-2024274572-A1 · Aug 15, 2024 · US
Semiconductor substrate and manufacturing method thereof
US-2024274520-A1 · Aug 15, 2024 · US
Electronic package and manufacturing method thereof
US-2024274519-A1 · Aug 15, 2024 · US
Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Thermal expansion matched chip module with integrated liquid cooling
US-2024203822-A1 · Jun 20, 2024 · US
Integrated fan-out package and manufacturing method thereof
US-2024178120-A1 · May 30, 2024 · US
Connecting a chiplet to an interposer die and to a package interface using a spacer interconnect coupled to a portion of the chiplet
US-2024113004-A1 · Apr 4, 2024 · US
Package structure and method of manufacturing the same
US-2024105664-A1 · Mar 28, 2024 · US
Semiconductor structure, method of forming same, and memory
US-2024105706-A1 · Mar 28, 2024 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/73?
- CPC H01L24/73 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/73 (Electricity)?
- Our database includes 10,419 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/73 growing?
- Publication counts under this code: 1,529 in 2024 vs 1,785 in 2025 (latest complete years).