Pressure sensor having a Helmholtz resonator

Patent metadata

Field	Value
Publication number	US-10620073-B2
Application number	US-201816137084-A
Country	US
Kind code	B2
Filing date	Sep 20, 2018
Priority date	Feb 24, 2014
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adapter coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adapter and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.

First claim

What is claimed is:

1. A method, comprising:
providing a sensing element having a front-side and a back-side;
coupling a header to the back-side of the sensing element;
coupling a housing to the header;
coupling an adapter to the housing; and
forming a first cavity between at least a portion of the adapter and the sensing element such that at least the front-side of the sensing element is isolated from a stress applied at the adapter.

2. The method of claim 1 , further comprising securing the adapter to the housing.

3. The method of claim 1 , wherein forming the first cavity defines a first gap between the sensing element and the adapter, wherein the first gap is between 0.001 inches to 0.015 inches.

4. The method of claim 1 , further comprising forming a second cavity between the header and the adapter.

5. The method of claim 4 , wherein forming the second cavity at least partially isolates the header from a stress applied at the adapter.

6. The method of claim 4 , wherein forming the second cavity between the header and the adapter defines a second gap between the header and the adapter, wherein the second gap is between 0.005 inches to 0.040 inches.

7. The method of claim 1 , further comprising forming a front seal between the sensing element and a mating surface.

8. The method of claim 1 , further comprising measuring an environmental condition with the sensing element.

9. The method of claim 8 , wherein the environmental condition comprises one or more of pressure, temperature, and humidity.

10. The method of claim 1 , further comprising disposing a screen in an opening of the housing such that a third cavity is formed between the screen and the sensing element.

11. The method of claim 8 , wherein the screen in combination with at least the first cavity forms a Helmholtz resonator.

12. The method of claim 1 , wherein the first cavity is configured to reduce Helmholtz-related resonance.

13. A method, comprising:
providing a sensing element having a front-side and a back-side;
coupling a header to the back-side of the sensing element;
coupling a housing to the header;
coupling an adapter to the housing such that a first cavity is formed between the adapter and at least the front-side of the sensing element, and such that a second cavity is formed between the header and the adapter; and
disposing a screen in an opening of the housing, wherein a third cavity is formed between the screen and the front-side of the sensing element.

14. The method of claim 13 , wherein the screen in combination with one or more of the first cavity, the second cavity, and the third cavity form a Helmholtz resonator.

15. The method of claim 13 , wherein the first cavity is configured to isolate at least a portion of the sensing element from a stress applied at the adapter.

16. The method of claim 13 , further comprising securing the adapter to the housing.

17. The method of claim 13 , wherein the first cavity defines a first gap between the sensing element and the adapter, wherein the first gap is between 0.001 inches to 0.015 inches.

18. The method of claim 13 , wherein the second cavity defines a second gap between the header and the adapter, wherein the second gap is between 0.005 inches to 0.040 inches.

19. The method of claim 13 , further comprising forming a front seal between the sensing element and a mating surface.

20. The method of claim 13 , further comprising measuring an environmental condition with the sensing element, wherein the environmental condition comprises one or more of pressure, temperature, and humidity.

Assignees

• Kulite Semiconductor Products Inc

Inventors

• Derosa Louis
• Gardner Robert
• Vandeweert Joseph
• Hurst Adam

Classifications

• G01L11/04

  by acoustic means · CPC title

• G01L9/0054 Primary

  integral with a semiconducting diaphragm · CPC title

• G01L9/06 Primary

  of piezo-resistive devices · CPC title

• G01L9/0052

  of piezoresistive elements (circuits therefor G01L9/06) · CPC title