Pressure sensor having a helmholtz resonator

US10101229B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10101229-B2
Application numberUS-201615014166-A
CountryUS
Kind codeB2
Filing dateFeb 3, 2016
Priority dateFeb 24, 2014
Publication dateOct 16, 2018
Grant dateOct 16, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adaptor coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adaptor and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.

First claim

Opening claim text (preview).

What is claimed is: 1. A system, comprising: a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adaptor coupled to the housing; and a first gap disposed between the sensing element and the adapter, the first gap adapted to form a first cavity around at least a portion of the sensing element such that the sensing element is at least partially isolated from a stress applied at the adapter. 2. The system of claim 1 , wherein the first cavity is configured to reduce Helmholtz-related resonance. 3. The system of claim 1 , wherein the adaptor comprises a front surface adapted to form a front seal between the sensing element and a mating surface. 4. The system of claim 1 , further comprising a second gap disposed between the header and the adapter, the second gap adapted to form a second cavity around at least a portion of the header. 5. The system of claim 4 , wherein the second cavity is adapted such that the header is at least partially isolated from a stress applied at the adaptor. 6. The system of claim 4 , wherein the second gap is less than about 0.040 inches. 7. The system of claim 4 , wherein the second gap is in the range of between about 0.005 inches to about 0.040 inches. 8. The system of claim 1 , further comprising a screen disposed in an opening of the housing, wherein a third cavity is disposed between the screen and the sensing element. 9. The system of claim 8 , wherein the screen in combination with the first cavity and the second cavity form a Helmholtz resonator. 10. The system of claim 1 , wherein the first gap is less than about 0.015 inches. 11. The system of claim 1 , wherein the first gap is in the range of between about 0.001 inches to about 0.015 inches. 12. The system of claim 1 , wherein the sensing element is a piezoresistive leadless sensor. 13. The system of claim 1 , wherein the sensing element is used to measure a pressure. 14. The system of claim 1 , wherein the adapter is disposed around and defines an opening and the sensing element is disposed in the opening. 15. The system of claim 14 , wherein a size and a shape of the opening is about equivalent to a corresponding size and a corresponding shape of the sensing element. 16. The system of claim 1 , wherein the first gap is configured to allow a fluid to be disposed between the adaptor and the sensing element. 17. The system of claim 16 , wherein the adapter is disposed around and defines an opening and the sensing element is disposed in the opening, and wherein a size and a shape of the opening is about equivalent to a corresponding size and a corresponding shape of the sensing element to reduce fluid impact on the sensing element. 18. The system of claim 15 , wherein the shape of the opening is square. 19. The system of claim 1 , wherein a response time of the sensing element is less than about fifty microseconds. 20. The system of claim 1 , wherein a stress applied at a front surface of the adapter is transferred to the housing.

Assignees

Inventors

Classifications

  • G01L9/0054Primary

    integral with a semiconducting diaphragm · CPC title

  • of piezoresistive elements (circuits therefor G01L9/06) · CPC title

  • by acoustic means · CPC title

  • G01L9/06Primary

    of piezo-resistive devices · CPC title

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Frequently asked questions

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What does patent US10101229B2 cover?
This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adaptor coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing elem…
Who is the assignee on this patent?
Kulite Semiconductor Products Inc, Kulito Semiconductor Products Inc
What technology area does this patent fall under?
Primary CPC classification G01L9/0054. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).