Substrate processing apparatus, substrate processing method, and storage medium

Patent metadata

Field	Value
Publication number	US-10619922-B2
Application number	US-201715441864-A
Country	US
Kind code	B2
Filing date	Feb 24, 2017
Priority date	Mar 3, 2016
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

Provided is a substrate processing apparatus including a processing container configured to receive a substrate on which a dry preventing liquid is filled and perform a supercritical processing on the substrate; a fluid supply line connected to the processing container and configured to supply a processing fluid to the processing container; a fluid discharge line connected to the processing container and configured to discharge the processing fluid in the processing container; and a first circulation line connected to an upstream side and a downstream side of the processing container, and provided independently from the fluid supply line and the fluid discharge line to circulate the processing fluid in the processing container. The first circulation line is provided with a first reservoir tank that receives the processing fluid from the processing container and has a capacity larger than that of the processing container.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a processing container configured to receive a substrate on which a dry preventing liquid is filled and perform a supercritical processing on the substrate;
a fluid supply line connected to the processing container via a first valve and configured to supply a processing fluid to the processing container;
a fluid discharge line connected to the processing container and configured to discharge the processing fluid in the processing container;
a first circulation line connected to an upstream side and a downstream side of the processing container via a second valve, and provided independently from the fluid supply line and the fluid discharge line to circulate the processing fluid in the processing container; and
a controller configured to control an overall operation of the substrate processing apparatus,
wherein the first circulation line is provided with a first reservoir tank that receives the processing fluid from the processing container and has a capacity larger than that of the processing container,
the fluid supply line is provided with a booster pump that boosts the processing fluid to a pressure at which the processing fluid becomes a supercritical state and supplies the processing fluid to the processing container,
the first circulation line is provided with a first circulation pump to circulate the processing fluid in the processing container, and
when the processing fluid in an inside of the processing container and the first reservoir tank reaches the supercritical state, the controller stops the booster pump, closes the first valve of the fluid supply line and the second valve of the first circulation line, and controls the first circulation pump such that an ejection flow rate of the first circulation pump is higher than an ejection flow rate of the booster pump.

2. The substrate processing apparatus of claim 1 , wherein the first reservoir tank has a capacity such that the dry preventing liquid filled on the substrate is not saturated even when the dry preventing liquid is dissolved in the processing fluid of a supercritical state or a subcritical state in the first reservoir tank.

3. The substrate processing apparatus of claim 1 , wherein the first reservoir tank is provided at an upstream side of the first circulation pump.

4. The substrate processing apparatus of claim 1 , wherein the first reservoir tank includes a fluid discharge device to discharge the processing fluid.

5. The substrate processing apparatus of claim 1 , further comprising:
a second circulation line connected at an upstream side and a downstream side of the processing container, and provided independently from the first circulation line to circulate the fluid in the processing container,
wherein the second circulation line is provided with a second reservoir tank that receives the processing fluid from the processing container and has a capacity larger than that of the processing container.

6. The substrate processing apparatus of claim 5 , wherein the processing container includes a downstream-side switch valve at a downstream side thereof to switch the first circulation line and the second circulation line, and
the controller is configured to operate the downstream-side switch valve to switch the first circulation line to the second circulation line when a number of substrates processed in the processing container reaches a predetermined number.

7. The substrate processing apparatus of claim 1 , wherein the processing container includes a fluid supply header connected to the fluid supply line and a fluid discharge header connected to the fluid discharge line so as to form a laminar flow of the processing fluid in the processing container.

8. A substrate processing method, comprising:
carrying a substrate on which a dry preventing liquid is filled into a processing container;
supplying a processing fluid to the processing container through a fluid supply line with a first valve;
performing a supercritical processing on the substrate in the processing container using the processing fluid;
discharging the processing fluid in the processing container through a fluid discharge line; and
circulating the processing fluid in the processing container by a first circulation line connected to an upstream side and a downstream side of the processing container with a second valve which is provided independently from the fluid supply line and the fluid discharge line,
wherein the processing fluid from the processing container is received by a first reservoir tank that is provided in the first circulation line and has a capacity larger than that of the processing container,
the fluid supply line is provided with a booster pump that boosts the processing fluid to a pressure at which the processing fluid becomes a supercritical state and supplies the processing fluid to the processing container,
the first circulation line is provided with a first circulation pump to circulate the processing fluid in the processing container, and
in the circulating the processing fluid, when the processing fluid in an inside of the processing container and the first reservoir tank reaches the supercritical state, the booster pump is stopped, the first valve of the fluid supply line and the second valve of the first circulation line are closed, and the first circulation pump is controlled such that an ejection flow rate of the first circulation pump is higher than an ejection flow rate of the booster pump.

9. A non-transitory computer-readable storage medium that stores a program which, when executed, causes a computer to execute a substrate processing method, the substrate processing method including:
carrying a substrate on which a dry preventing liquid is filled into a processing container;
supplying a processing fluid to the processing container through a fluid supply line with a first valve;
performing a supercritical processing on the substrate in the processing container using the processing fluid;
discharging the processing fluid in the processing container through a fluid discharge line; and
circulating the processing fluid in the processing container by a first circulation line connected to an upstream side and a downstream side of the processing container with a second valve which is provided independently from the fluid supply line and the fluid discharge line,
wherein the processing fluid from the processing container is received by a first reservoir tank that is provided in the first circulation line and has a capacity larger than that of the processing container,
the fluid supply line is provided with a booster pump that boosts the processing fluid to a pressure at which the processing fluid becomes a supercritical state and supplies the processing fluid to the processing container,
the first circulation line is provided with a first circulation pump to circulate the processing fluid in the processing container, and
in the circulating the processing fluid, when the processing fluid in an inside of the processing container and the first reservoir tank reaches the supercritical state, the booster pump is stopped, the first valve of the fluid supply line and the second valve of the first circulation line are closed, and the first circulation pump is controlled such that an ejection flow rate of the first circulation pump is higher than an ejection flow rate of the booster pump.

10. The substrate processing apparatus of claim 1 , wherein the ejection flow rate of the booster pump is about 0.1 to about 3.0 L/min, and
the ejection flow rate of the first circulation pump is about 10 to about 40 L/min.

11. The substrate processing apparat

Assignees

• Tokyo Electron Ltd

Inventors

• Goshi Gentaro
• Kiyose Hiromi
• Biwa Satoshi

Classifications

• F26B9/06

  in stationary drums or chambers · CPC title

• F26B5/00

  Drying solid materials or objects by processes not involving the application of heat (separating liquids from solids by straining B01D; replacing liquids in wet solids by other liquids, e.g. water by spirit, B01D12/00; drying by electrophoresis B01J) · CPC title

• H01L21/67034

  Electricity · mapped topic

• H01L21/02101

  Electricity · mapped topic

• F26B21/14 Primary

  Mechanical Engineering · mapped topic