Package for an implantable neural stimulation device

Patent metadata

Field	Value
Publication number	US-10617868-B2
Application number	US-201715629196-A
Country	US
Kind code	B2
Filing date	Jun 21, 2017
Priority date	Aug 18, 2006
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

An implantable device having a biocompatible hermetic package made from a biocompatible electrically non-conductive substrate and a cover bonded to the substrate. In integrated circuit and passive circuits all bonded directly to the substrate.

First claim

What we claim is:

1. An implantable device, comprising:
a biocompatible electrically non-conductive substrate;
a plurality of electrically conductive vias through the electrically non-conductive substrate, forming a via substrate;
an integrated circuit attached directly to the via substrate;
discrete passive circuits attached directly to the via substrate to the side of the integrated circuit;
a biocompatible cover brazed to the via substrate with a biocompatible braze, the cover and the via substrate forming a hermetic package;
conductive traces deposited on the via substrate; and
a braze stop on the via substrate and along a periphery of the via substrate surrounding the conductive traces and separating a braze joint from the conductive traces.

2. The implantable device according to claim 1 , further comprising a flexible circuit connected to the via substrate and including electrodes suitable to stimulate neural tissue.

3. The implantable device according to claim 1 , further comprising a polymer body supporting the hermetic package and suitable to be attached to a sclera.

4. The implantable device according to claim 3 , further comprising suture tabs on the polymer body suitable for attaching the polymer body to a sclera.

5. The implantable device according to claim 1 , wherein the cover has convex in profile.

6. The implantable device according to claim 1 , wherein the cover has concave in profile.

7. The implantable device according to claim 1 , wherein the integrated circuit is a flip-chip circuit.

8. The implantable device according to claim 1 , wherein the cover is brazed to the via substrate.

9. The implantable device according to claim 8 , further comprising a braze stop on the via substrate and along a periphery of the via substrate surrounding the conductive traces and separating a braze joint from the conductive traces.

10. The implantable device according to claim 1 , wherein the conductive traces are metal traces.

11. The implantable device according to claim 10 , wherein the metal traces are chosen to withstand braze temperatures.

12. The implantable device according to claim 11 , wherein the metal traces comprise one or more of the metals titanium, tantalum, gold, palladium, platinum or layers or alloys thereof.

Assignees

• Second Sight Medical Products Inc

Inventors

• Ok Jerry
• Greenberg Robert J
• Talbot Neil Hamilton
• Little James S
• Dai Rongqing
• Neysmith Jordan Matthew
• Mcclure Kelly H

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• A61N1/375

  Constructional arrangements, e.g. casings · CPC title

• A61N1/0529

  Electrodes for brain stimulation · CPC title

• A61F15/001

  Packages or dispensers for bandages, cotton balls, drapes, dressings, gauze, gowns, sheets, sponges, swabsticks or towels (A61F15/007 takes precedence) · CPC title

• A61N1/0543

  Retinal electrodes · CPC title