Electrical busbar
US-2018334116-A1 · Nov 22, 2018 · US
US10615767B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10615767-B2 |
| Application number | US-201815942986-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 2, 2018 |
| Priority date | May 2, 2017 |
| Publication date | Apr 7, 2020 |
| Grant date | Apr 7, 2020 |
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The invention which relates to an EMC filter (1) addresses the problem of specifying an EMC filter (1) that is simple of structure, cost-effective and temperature resistant. This problem is resolved thereby that the core of the choke (4, 5) is comprised of one or two core parts (10), that at least one first planar or convex heat transfer area (23) is located on an outside of the core and that the core with this first planar or convex heat transfer area (23) is disposed on a housing (12) of the refrigerant compressor, wherein the housing (12) in the region of the first planar or convex heat transfer area (23) is implemented planar or concave.
Opening claim text (preview).
The invention claimed is: 1. An electromagnetic compatibility (EMC) filter connected to an inverter of a refrigerant compressor and comprising at least one choke with a core and several capacitors, wherein the core of the choke is developed having one or two core parts, wherein at least one first planar or convex heat transfer area is disposed on an outside of the core, wherein the core with this first planar or convex heat transfer area is disposed on a housing of the refrigerant compressor, wherein the housing in the region of the first planar or convex heat transfer area is implemented planar or concave; wherein as the winding of the choke in the core a bus bar is disposed; and wherein the bus bar is electrically conducting connected to the circuit board of the inverter and wherein the capacitors of the passive EMC filter are disposed on the circuit board. 2. An EMC filter as in claim 1 , wherein a second planar or convex heat transfer area is disposed on the outside of the core, and wherein the second planar or convex heat transfer area is disposed oriented in parallel or oppositely to the first planar or convex heat transfer area. 3. An EMC filter as in claim 1 , wherein a bracket is disposed on a second planar or convex heat transfer area of the core and wherein the bracket is connected with the housing. 4. An EMC filter as in claim 1 , wherein a cap is disposed on a second planar or convex heat transfer area of the core, wherein the cap is connected with the housing, and wherein the cap in the region of the second planar or convex heat transfer area is implemented planar or concave. 5. An EMC filter according to claim 1 , wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. 6. An EMC filter according to claim 1 , wherein a thermally conductive layer is disposed between the second planar or convex heat transfer area and the bracket or the cap. 7. An EMC filter according to claim claim 5 , wherein a thermally conductive paste or a gap pad is disposed as the thermally conductive layer. 8. An EMC filter according to claim 1 , wherein plate washers are disposed on a bracket plate, wherein the plate washers include holes for screws, bolts or adjusting pins; and wherein the bracket and the plate washers are bolted or secured on the housing with the screws, the bolts or the adjusting pins. 9. An EMC filter as in claim 2 , wherein a cap is disposed on the second planar or convex heat transfer area of the core, and wherein the cap is connected with the housing, wherein the cap in the region of the second planar or convex heat transfer area is implemented planar or concave. 10. An EMC filter according to claim 2 , wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. 11. An EMC filter according to claim 3 , wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. 12. An EMC filter according to claim 4 , wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. 13. An EMC filter as in claim 2 , wherein a bracket is disposed on a second planar or convex heat transfer area of the core and wherein the bracket is connected with the housing. 14. An EMC filter as in claim 2 , wherein a bracket is disposed on a second planar or convex heat transfer area of the core and wherein the bracket is connected with the housing. 15. An EMC filter as in claim 4 , wherein a bracket is disposed on a second planar or convex heat transfer area of the core and wherein the bracket is connected with the housing. 16. An EMC filter according to claim 4 , wherein a thermally conductive layer is disposed between the first planar or convex heat transfer area and the housing. 17. An EMC filter according to claim 3 , wherein plate washers are disposed on a bracket plate, wherein the plate washers include holes for screws, bolts or adjusting pins; and wherein the bracket and the plate washers are bolted or secured on the housing with the screws, the bolts or the adjusting pins. 18. An EMC filter according to claim 4 , wherein plate washers are disposed on a bracket plate, wherein the plate washers include holes for screws, bolts or adjusting pins; and wherein the bracket and the plate washers are bolted or secured on the housing with the screws, the bolts or the adjusting pins. 19. An EMC filter according to claim 5 , wherein plate washers are disposed on a bracket plate, wherein the plate washers include holes for screws, bolts or adjusting pins; and wherein the bracket and the plate washers are bolted or secured on the housing with the screws, the bolts or the adjusting pins. 20. An EMC filter according to claim 6 , wherein plate washers are disposed on a bracket plate, wherein the plate washers include holes for screws, bolts or adjusting pins; and wherein the bracket and the plate washers are bolted or secured on the housing with the screws, the bolts or the adjusting pins.
Circuits or arrangements for compensating for electromagnetic interference in converters or inverters · CPC title
Liquid cooling · CPC title
Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors · CPC title
characterised by constructional features, e.g. housings, mountings, conversion systems (B60H1/3227, B60H1/3233 take precedence) · CPC title
Cooling by heat conduction through solid or powdered fillings · CPC title
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