Composite cover assembly for electronic devices
US-9626024-B1 · Apr 18, 2017 · US
US10613652B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10613652-B2 |
| Application number | US-201615051632-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2016 |
| Priority date | Feb 25, 2015 |
| Publication date | Apr 7, 2020 |
| Grant date | Apr 7, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A touch display apparatus is disclosed. The touch display apparatus includes an electrophoretic structure, a protective layer and at least one touch sensing layer. The protective layer is disposed on the electrophoretic structure. The touch sensing layer is disposed on the protective layer and takes the protective layer as a carrier.
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a touch display apparatus, comprising; forming a touch sensing layer on a protective layer on an electrophoretic structure, wherein forming the touch sensing layer on the protective layer comprises; providing a thin film substrate; forming a sensing electrode layer on the thin film substrate; and adhering the thin film substrate onto the protective layer; and disposing a flexible circuit board on the sensing electrode layer and electrically connecting the flexible circuit board and the sensing electrode layer at an operation temperature, wherein the operation temperature ranges from 120° C. to 150° C. 2. The method of claim 1 , wherein the flexible circuit board is disposed on the sensing electrode layer before the thin film substrate is adhered onto the protective layer. 3. The method of claim 1 , wherein the flexible circuit board is disposed on the sensing electrode layer after the thin film substrate is adhered onto the protective layer. 4. The method of claim 1 , further comprising placing a light guide plate over the touch sensing layer to cover the touch sensing layer. 5. The method of claim 1 , further comprising forming a thin film transistor (TFT) array in direct contact with the electrophoretic structure. 6. The method of claim 1 , further comprising forming a shielding layer between the electrophoretic structure and the protective layer. 7. The method of claim 1 , wherein the electrophoretic structure includes a plurality of microcapsules, and each of the plurality of microcapsules has a plurality of light-colored charged particles and a plurality of dark-colored charged parties. 8. The method of claim 7 , wherein the plurality of light-colored charged particles and the plurality of dark-colored charged parties have charges of different types. 9. The method of claim 1 , wherein a material of the protective layer comprises polymethylmethacrylate (PMMA), polycarbonate (PC), polyvinyl chloride (PVC) or polyethylene terephthalate (PET). 10. The method of claim 1 , wherein a material of the thin film substrate comprises polymethylmethacrylate (PMMA), polycarbonate (PC), polyvinyl chloride (PVC) or polyethylene terephthalate (PET). 11. The method of claim 1 , wherein the sensing electrode layer comprises a light permeable material or a plurality of nano metal wires therein. 12. The method of claim 1 , wherein a thickness of the touch sensing layer is less than 0.06 mm. 13. The method of claim 6 , wherein a material of the shielding layer comprises a conductive material.
Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less · CPC title
Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title
Protective arrangements · CPC title
by electrophoresis · CPC title
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.