Method for electrochemical roughening of thin film electrodes

US10612153B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10612153-B2
Application numberUS-201715615648-A
CountryUS
Kind codeB2
Filing dateJun 6, 2017
Priority dateJun 6, 2016
Publication dateApr 7, 2020
Grant dateApr 7, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.

First claim

Opening claim text (preview).

We claim: 1. A method of electrochemically roughening a substrate, comprising: forming an electrochemical etch template comprising polymer particles adsorbed on a surface of a substrate to be roughened; and electrochemically etching exposed regions of the substrate defined by voids between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. 2. The method of claim 1 , wherein the step of forming the electrochemical etch template includes coating a surface of the substrate with an aqueous solution comprising polymer and acid, and heating the aqueous solution so that the polymer forms a solid domain of a liquid crystal which forms an electrochemical etch template on the surface of the substrate. 3. The method of claim 1 , wherein the step of forming the electrochemical etch template includes coating a surface of the substrate with polystyrene microspheres. 4. A method of electrochemically roughening a Pt thin film substrate, comprising: immersing a surface of the substrate in an adsorbing acidic solution; and electrochemically pulse etching the surface of the substrate, wherein the electrochemical pulse etching is performed in a frequency range of greater than 200 Hz to about 450 Hz. 5. The method of claim 4 , wherein the adsorbing acidic solution is sulfuric acid. 6. A method of electrochemically roughening a Pt thin film substrate, comprising: immersing a surface of the substrate in a non-adsorbing acidic solution; and electrochemically pulse etching the surface of the substrate, wherein the electrochemical pulse etching is performed in a frequency range of about 250 Hz to about 5000 Hz. 7. The method of claim 6 , wherein the non-adsorbing acidic solution is perchloric acid.

Assignees

Inventors

Classifications

  • Etching · CPC title

  • Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating · CPC title

  • C25F3/14Primary

    locally · CPC title

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What does patent US10612153B2 cover?
The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the…
Who is the assignee on this patent?
Ivanovskaya Anna Nikolaevna, Tolosa Vanessa, Dahlquist Dylan, and 5 more
What technology area does this patent fall under?
Primary CPC classification C25F3/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).