Plated member and plated terminal for connector
US-9755343-B2 · Sep 5, 2017 · US
Vehicle-mounted electronic module, card edge connector, and connector
US10601158B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10601158-B2 |
| Application number | US-201616070660-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 22, 2016 |
| Priority date | Jan 22, 2016 |
| Publication date | Mar 24, 2020 |
| Grant date | Mar 24, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
The in-vehicle electronic module includes a circuit board on which an electronic component is mounted, and a protection member accommodating the circuit board and protecting the circuit board from a surrounding environment and has a structure where a surface layer at an end portion of the circuit board is made of an 1 Ag-containing Sn-based solder having average thickness of 4 μm or more, and a surface material of a connection terminal of one card edge connector has a two layer structure of a soft noble metal layer of Ag, Pd, Pt, or the like/a reaction layer of a hard noble metal and Sn or an Ni layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. An in-vehicle electronic module comprising: a circuit board on which an electronic component is mounted; and a protection member accommodating the circuit board, wherein the circuit board has an end portion protruding into an external space from the protection member, the end portion of the board comprises a connection terminal on a surface thereof for being inserted into an external female connector to obtain electrical conduction, and the connection terminal comprising a Cu wire line, a solder layer having Sn as a main component and comprising an Ag—Sn intermetallic compound disposed above the Cu wire line, and a Cu—Sn reaction layer disposed between the Cu wire line and the solder layer. 2. The in-vehicle electronic module according to claim 1 , wherein the solder layer has an average thickness of 4 micrometers (μm) or more. 3. The in-vehicle electronic module according to claim 1 , wherein the Ag—Sn intermetallic compound has a grain size of 1 μm or more.
Assignees
Inventors
Classifications
Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title
characterised by the material, e.g. plating, or coating materials · CPC title
Shields or metal cases · CPC title
Use of materials for the {conductive, e.g. } metallic pattern · CPC title
- H01R12/72Primary
coupling with the edge of the rigid printed circuits or like structures · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10601158B2 cover?
- The in-vehicle electronic module includes a circuit board on which an electronic component is mounted, and a protection member accommodating the circuit board and protecting the circuit board from a surrounding environment and has a structure where a surface layer at an end portion of the circuit board is made of an 1 Ag-containing Sn-based solder having average thickness of 4 μm or more, and a…
- Who is the assignee on this patent?
- Hitachi Automotive Systems Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01R12/72. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).