Method of selectively etching first region made of silicon nitride against second region made of silicon oxide

Patent metadata

Field	Value
Publication number	US-10600660-B2
Application number	US-201916394089-A
Country	US
Kind code	B2
Filing date	Apr 25, 2019
Priority date	Dec 13, 2016
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

Generation of a deposit can be suppressed and high selectivity can be acquired when etching a first region made of silicon nitride selectively against a second region made of silicon oxide. A method includes preparing a processing target object having the first region and the second region within a chamber provided in a chamber main body of a plasma processing apparatus; generating plasma of a first gas including a gas containing hydrogen within the chamber to form a modified region by modifying a part of the first region with active species of the hydrogen; and generating plasma of a second gas including a gas containing fluorine within the chamber to remove the modified region with active species of the fluorine.

First claim

We claim:

1. A method of etching a first region made of silicon nitride selectively against a second region made of silicon oxide, comprising:
preparing a processing target object having the first region and the second region within a chamber provided in a chamber main body of a plasma processing apparatus;
generating plasma of a first gas including a gas containing hydrogen within the chamber to form a modified region by modifying a part of the first region with active species of the hydrogen; and
generating plasma of a second gas including a gas containing fluorine within the chamber to remove the modified region with active species of the fluorine,
wherein the processing target object is placed, within the chamber, on a stage including therein an electrode to which a high frequency power for attracting ions onto the processing target object is allowed to be supplied, and
the high frequency power is not supplied to the electrode in the generating of the plasma of the second gas.

2. The method of claim 1 ,
wherein the high frequency power is supplied to the electrode in the generating of the plasma of the first gas.

3. The method of claim 2 ,
wherein, in the generating of the plasma of the first gas, the plasma of the first gas is generated by the high frequency power supplied to the electrode.

4. The method of claim 1 ,
wherein the second gas includes a NF 3 gas as the gas containing fluorine.

5. The method of claim 1 ,
wherein the second gas further includes hydrogen, and
a ratio of a number of atoms of the hydrogen in the second gas to a number of atoms of the fluorine in the second gas is equal to or higher than 8/9.

6. The method of claim 4 ,
wherein the second gas further includes a H 2 gas.

7. The method of claim 6 ,
wherein a flow rate ratio of the H 2 gas in the second gas to the NF 3 gas in the second gas is equal to or higher than 3/4.

8. The method of claim 1 ,
wherein the first gas includes a H 2 gas as the gas containing hydrogen.

9. The method of claim 1 ,
wherein a plurality of sequences each of which includes the generating of the plasma of the first gas and the generating of the plasma of the second gas are performed in sequence.

10. The method of claim 9 , further comprising:
determining that a stop condition is satisfied when a repetition number of the plurality of sequences reaches a preset number, and
determining that the stop condition is not satisfied when the repetition number of the plurality of sequences does not reaches the preset number.

11. The method of claim 1 ,
wherein the second gas further contains oxygen.

12. The method of claim 1 ,
wherein the second gas further contains hydrogen.

13. The method of claim 1 ,
wherein in the generating of the plasma of the first gas, a bias power is supplied to a stage which is configured to hold the processing target object mounted thereon.

14. The method of claim 1 ,
wherein in the generating of the plasma of the first gas, a bias power is supplied to a stage configured to hold the processing target object mounted thereon, and a high frequency power is supplied to an inductively coupled plasma antenna.

15. The method of claim 1 ,
wherein in the generating of the plasma of the second gas, a high frequency power is supplied to an inductively coupled plasma antenna.

16. The method of claim 13 ,
wherein in the generating of the plasma of the second gas, a high frequency power is supplied to an inductively coupled plasma antenna.

17. The method of claim 1 ,
wherein the preparing of the processing target object comprises:
forming a silicon oxide layer on a silicon nitride layer; and
etching the silicon oxide layer to expose a portion of the silicon nitride layer, and
the exposed portion of the silicon nitride layer is the first region, and the silicon oxide layer is the second region.

18. The method of claim 17 ,
wherein the forming of the silicon oxide layer on the silicon nitride layer comprises:
exposing the silicon nitride layer to a third gas to form a precursor layer on the silicon nitride layer; and
exposing the precursor layer to a fourth gas to form the silicon oxide layer.

19. The method of claim 18 ,
wherein the third gas includes an organic-containing aminosilane-based gas.

20. The method of claim 18 ,
wherein the fourth gas includes a gas containing oxygen atoms.

Assignees

• Tokyo Electron Ltd

Inventors

• Tabata Masahiro
• Kumakura Sho

Classifications

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P50/283 Primary

  by chemical means · CPC title

• H10P72/0421 Primary

  for drying etching · CPC title

• H01J37/00

  Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof (H01J33/00, H01J40/00, H01J41/00, H01J47/00, H01J49/00 take precedence) · CPC title

• H01J2237/334

  Etching · CPC title