Small pitch direct view display and method of making thereof

Patent metadata

Field	Value
Publication number	US-10600354-B2
Application number	US-201715493787-A
Country	US
Kind code	B2
Filing date	Apr 21, 2017
Priority date	Apr 22, 2016
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A direct view display device includes a printed circuit board, an array of pixels located on a first side of the printed circuit board, each pixel including a plurality of light emitting diodes, and an isolation grid comprising a light absorbing material located between the pixels in the array of pixels.

First claim

The invention claimed is:

1. A direct view display device comprising:
a printed circuit board;
an array of pixels located on a first side of the printed circuit board, each pixel comprising a plurality of light emitting diodes (LEDs);
an isolation grid comprising a light absorbing material located between the pixels in the array of pixels, wherein the isolation grid contacts and is attached to a top surface of the printed circuit board; and
further comprising a first transparent encapsulation material layer located over the isolation grid and the array of pixels.

2. The direct view display device of claim 1 , further comprising a contamination-resistant transparent coating layer located on the first transparent encapsulation material and comprising a material that is more resistant to pick-up of contaminants than the transparent encapsulation material layer.

3. The direct view display device of claim 1 , further comprising:
driver electronics mounted on a second side of the printed circuit board; and
a second encapsulation material layer located over the driver electronics.

4. The direct view display device of claim 1 , wherein each pixel comprises a red light emitting LED, a blue light emitting LED and a green light emitting LED.

5. The direct view display device of claim 1 , wherein the isolation grid extends at least up to a height of a topmost surface of the array of pixels.

6. The direct view display device of claim 1 , wherein the isolation grid comprises a free-standing grid made of a plastic light absorbing material.

7. The direct view display device of claim 6 , wherein the light absorbing material comprises a black colored polycarbonate plastic material.

8. The direct view display device of claim 1 , wherein the isolation grid comprises a printed UV curable or thermally applied material.

9. The direct view display device of claim 8 , wherein the light absorbing material comprises a printed and UV cured black ink.

10. A method of forming a direct view display device, comprising:
providing a printed circuit board;
attaching light emitting diodes (LEDs) to a first side of the printed circuit board to form an array of pixels, each pixel comprising a plurality of the LEDs;
providing an isolation grid comprising a light absorbing material between the pixels in the array of pixels by attaching the isolation grid directly to a top surface of the printed circuit board located on the first side prior to, or after, attaching the LEDs; and
further comprising forming a first transparent encapsulation material layer over the isolation grid and the array of pixels.

11. The method of claim 10 , further comprising forming contamination-resistant transparent coating layer on the first transparent encapsulation material, the contamination-resistant transparent coating layer comprising a material that is more resistant to pick-up of contaminants than the transparent encapsulation material layer.

12. The method of claim 10 , further comprising:
providing driver electronics and the printed circuit board;
mounting the provided driver electronics on a second side of the provided printed circuit board; and
forming a second encapsulation material layer over the driver electronics prior to attaching the light emitting diodes to the first side of the printed circuit board.

13. The method of claim 10 , wherein each pixel comprises a red light emitting LED, a blue light emitting LED and a green light emitting LED.

14. The method of claim 10 , wherein the isolation grid extends at least up to a height of a topmost surface of the array of pixels.

15. The method of claim 10 , wherein providing the isolation grid comprises forming a free-standing isolation grid made of a plastic light absorbing material and attaching the free-standing isolation grid to the first side of the printed circuit board.

16. The method of claim 15 , wherein the light absorbing material comprises injection molded, black colored polycarbonate plastic material.

17. The method of claim 10 , wherein providing the isolation grid comprises printing a UV curable or thermally applied material between the pixels on the first side of the printed circuit board.

18. The method of claim 17 , wherein the light absorbing material comprises a printed, UV curable black ink which is UV cured after being printed.

19. A direct view display device comprising:
a printed circuit board;
an array of pixels located on a first side of the printed circuit board, each pixel comprising a plurality of light emitting diodes (LEDs);
an isolation grid comprising a light absorbing material located between the pixels in the array of pixels, wherein the isolation grid extends at least up to a height of a topmost surface of the LEDs in the array of pixels; and
a first transparent encapsulation material layer located over the isolation grid and the array of pixels.

20. The direct view display device of claim 19 , wherein the isolation grid is located between sides of the pixels and extends to the height of the topmost surface of the array of pixels as well as above the height of the topmost surface of the array of pixels.

Assignees

• Glo Ab

Inventors

• Deeman Neil
• Jansen Michael
• Lee Hyung-Chul
• Liu Kai
• Okui Kazunori

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K1/0274 Primary

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K2201/10522

  Adjacent components · CPC title

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title