Method for producing heat sink

US10596618B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10596618-B2
Application numberUS-201715684333-A
CountryUS
Kind codeB2
Filing dateAug 23, 2017
Priority dateAug 24, 2016
Publication dateMar 24, 2020
Grant dateMar 24, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to the substrate through spraying or dropping in the period from when the molding dies are opened after the casting until when the temperature of the substrate that has been cast becomes lower than the deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing a heat sink having a substrate and a heat radiating film formed on a surface of the substrate, comprising: a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to a surface of the substrate to be coated through spraying or dropping in a period from when the molding dies are opened after the casting until when a temperature of the substrate that has been cast becomes lower than a deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate, wherein the heat radiating coating is applied to the surface of the substrate to be coated while the substrate is left in a part of the molding dies immediately after the molding dies are opened, and the surface of the substrate to be coated is thus exposed, and wherein the heat radiating coating is baked by heat of the surface of the substrate. 2. The method for producing a heat sink according to claim 1 , wherein: the surface of the substrate molded through the casting in the first step has a fin structure, and in the second step, the heat radiating coating is applied to the fin structure of the substrate through spraying or dropping. 3. The method for producing a heat sink according to claim 1 , wherein: the temperature of the substrate when the heat radiating coating is applied thereto in the second step is in a range of greater than or equal to the deposition temperature of the heat radiating coating and less than a preset temperature that is higher than the deposition temperature by a predetermined temperature. 4. The method for producing a heat sink according to claim 3 , wherein: the heat radiating coating contains thermosetting resin, the deposition temperature is defined as a curing temperature at which the thermosetting resin cures, and the temperature of the substrate when the heat radiating coating is applied thereto in the second step is in a range of greater than or equal to the curing temperature and less than a preset temperature that is higher than the curing temperature by a predetermined temperature. 5. The method for producing a heat sink according to claim 3 , wherein: the heat radiating coating contains thermoplastic resin, the deposition temperature is defined as a softening temperature at which the thermoplastic resin softens, and the temperature of the substrate when the heat radiating coating is applied thereto in the second step is in a range of greater than or equal to the softening temperature and less than a preset temperature that is higher than the softening temperature by a predetermined temperature. 6. The method for producing a heat sink according to claim 1 , wherein a surface roughness Ra of the heat radiating film formed is greater than or equal to 5 μm. 7. The method for producing a heat sink according to claim 1 , wherein the method is free of a baking step in a baking furnace.

Assignees

Inventors

Classifications

  • Polyamides · CPC title

  • B22D17/00Primary

    Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure · CPC title

  • to metal, e.g. car bodies (involving a chemical reaction between the metal and the coating C23) · CPC title

  • Polyimides · CPC title

  • performed by spraying · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10596618B2 cover?
Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a sub…
Who is the assignee on this patent?
SUGIURA Naoaki, Furukawa Yuichi, Kobayashi Mitsuhiro, and 4 more
What technology area does this patent fall under?
Primary CPC classification B22D17/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).