Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system

Patent metadata

Field	Value
Publication number	US-2016338228-A1
Application number	US-201615215174-A
Country	US
Kind code	A1
Filing date	Jul 20, 2016
Priority date	Jan 21, 2014
Publication date	Nov 17, 2016
Grant date	—

Abstract

A heat dissipating component comprising: a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to an electronic component; and a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins.

First claim

What is claimed is:

1 . A heat dissipating component comprising:
a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to an electronic component; and a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins.

2 . The heat dissipating component of claim 1 , wherein:
the covering portion is provided at a bottom portion side of the groove; and at a side face portion of the fins, a portion further to an apex side of the fins than the covering portion is exposed.

3 . The heat dissipating component of claim 1 , wherein
the heat dissipating sheet is formed from graphite.

4 . The heat dissipating component of claim 1 , wherein
the fins have pointed shapes that narrow in width toward the apexes thereof.

5 . The heat dissipating component of claim 1 , wherein
the main body includes a protrusion that supports the fins.

6 . The heat dissipating component of claim 1 , wherein:
the fins extend along a length direction intersecting a direction in which the plurality of fins are arrayed; an inner side of the fins and the groove are each open in the length direction of the fins; and a length of the heat dissipating sheet in the length direction is shorter than a length of the main body in the length direction.

7 . The heat dissipating component of claim 1 , wherein:
the bottom portion is at a lower position in a depth direction of the groove than the connecting portion.

8 . The heat dissipating component of claim 1 , wherein
at least a portion of a surface of the main body, or the covering portion, or a combination thereof, is treated by anti-fouling processing.

9 . A manufacturing method for a heat dissipating component, the manufacturing method comprising:
housing, in a mold, a heat dissipating sheet that is formed from a second material having higher thermal conductivity than a first material forming a main body of the heat dissipating component, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to an electronic component; and filling the first material into the mold, integrally forming the main body and the heat dissipating sheet, and forming a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins from the first material.

10 . The manufacturing method for a heat dissipating component of claim 9 , wherein
the first material is filled into the mold, and the main body and the covering portion are integrally formed.

11 . The manufacturing method for a heat dissipating component of claim 9 , wherein
the first material is filled into the mold, and the main body and the covering portion are integrated to the heat dissipating sheet.

12 . The manufacturing method for a heat dissipating component of claim 9 , wherein:
a set state is adopted in which the heat dissipating sheet bent so as to form the plurality of fins is housed inner side the mold, a length of the heat dissipating sheet along a length direction of the fins is shorter than a length of a cavity formed inner side the mold along the length direction, and the bottom portion is at a lower position in a depth direction of the groove than a leading end portion of a projection of the mold inserted into the groove; and in the set state, the first material is injected into the mold toward an inner side of the plurality of fins, the first material at the inner side of the plurality of fins passes through a gap between the heat dissipating sheet and a side face of the cavity and fills a gap between a leading end portion of a projection and the bottom portion, so as to form the covering portion from the first material.

13 . The manufacturing method for a heat dissipating component of claim 9 , wherein
a set state is adopted in which the heat dissipating sheet bent so as to form the plurality of fins is housed inner side the mold, and an inflow port is formed in the bottom portion; and in the set state, the first material is injected into the mold toward an inner side of the plurality of fins, the first material at the inner side of the plurality of fins passes through the inflow port and fills a gap between a leading end portion of a projection and the bottom portion, so as to form the covering portion from the first material.

14 . An electronic device comprising:
an electronic component; a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to the electronic component; and a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins.

15 . The electronic device of claim 14 , wherein
the electronic component is a thermoelectric element thermally connected to an installation target that is provided at an opposite side of the electronic component from the heat dissipating sheet such that the electronic component is sandwiched therebetween.

16 . A manufacturing method for an electronic device, the manufacturing method comprising:
housing an electronic component in a mold together with housing, in the mold, a heat dissipating sheet that is formed from a second material having higher thermal conductivity than a first material forming a main body of a heat dissipating component, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to the electronic component; and filling the first material into the mold, integrally forming the main body that encapsulates the electronic component and the heat dissipating sheet, and forming a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins from the first material.

17 . An integrated module comprising:
a power supply section including a thermoelectric element thermally connected to an installation target; a main body that is formed from a first material and that encapsulates an electronic component; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to the electronic component; a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins; a detector that operates using power from the power supply section; and a communication section that operates using power from the power supply section and that transmits data detected by the detector.

18 . An information processing system comprising:
an integrated module; and a server that receives data transmitted from the integrated module, the integrated module including: a pow

Assignees

• Fujitsu Ltd

Inventors

• Suzuki Takashi
• Nakagawa Kanae

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title