Endoscope

Patent metadata

Field	Value
Publication number	US-10595718-B2
Application number	US-201715614621-A
Country	US
Kind code	B2
Filing date	Jun 6, 2017
Priority date	Jul 11, 2016
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

The endoscope includes an imaging device that is provided in a tip portion of an insertion part capable of being inserted into a body cavity. The imaging device includes an image sensor that photoelectrically converts imaging light incident on an image receiving surface thereof through an imaging lens provided in a lens barrel, and a circuit substrate including a connecting surface facing a terminal face that is a surface opposite to the image receiving surface of the image sensor. A plurality of terminals are uniformly arranged longitudinally and laterally in a two-dimensional matrix form on the terminal face of the image sensor, and the connecting surface of the circuit substrate and the terminal face of the image sensor are connected to each other through the plurality of terminals. The total area of the plurality of terminals on the terminal face occupies 10% or more of the area of an imaging area of the image receiving surface.

First claim

What is claimed is:

1. An endoscope comprising:
an imaging device that is provided in a tip portion of an insertion part capable of being inserted into a body cavity,
wherein the imaging device includes a solid-state imaging element that photoelectrically converts imaging light incident on an image receiving surface thereof through an imaging lens, and a circuit substrate including a connecting surface facing a terminal face that is a surface opposite to the image receiving surface of the solid-state imaging element,
a plurality of terminals are uniformly arranged longitudinally and laterally in a two-dimensional matrix form on the terminal face of the solid-state imaging element,
the connecting surface of the circuit substrate and the terminal face of the solid-state imaging element are connected to each other through the plurality of terminals, and
the total area of the plurality of terminals, which are arranged on the terminal face is 10% or more of the area of an imaging area of the image receiving surface of the solid-state imaging element,
wherein the circuit substrate is a rigid substrate of which bending stiffness is higher than bending stiffness of the solid-state imaging element.

2. The endoscope according to claim 1 ,
wherein the imaging device includes a prism on which the imaging light having passed through the imaging lens is incident, and
the solid-state imaging element is disposed such that the image receiving surface faces a light emitting surface of the prism and is parallel to a longitudinal direction of the insertion part.

3. The endoscope according to claim 2 ,
wherein the circuit substrate is a ceramic substrate.

4. The endoscope according to claim 3 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate and the flexible wiring board are electrically connected to each other through a connector.

5. The endoscope according to claim 3 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate includes a recessed portion in which an electronic component is mounted and which is provided outside a region of the circuit substrate and the flexible wiring board connected to each other.

6. The endoscope according to claim 2 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate and the flexible wiring board are electrically connected to each other through a connector.

7. The endoscope according to claim 2 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate includes a recessed portion in which an electronic component is mounted and which is provided outside a region of the circuit substrate and the flexible wiring board connected to each other.

8. The endoscope according to claim 1 ,
wherein the circuit substrate is a ceramic substrate.

9. The endoscope according to claim 8 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate and the flexible wiring board are electrically connected to each other through a connector.

10. The endoscope according to claim 8 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate includes a recessed portion in which an electronic component is mounted and which is provided outside a region of the circuit substrate and the flexible wiring board connected to each other.

11. The endoscope according to claim 1 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate and the flexible wiring board are electrically connected to each other through a connector.

12. The endoscope according to claim 11 ,
wherein the circuit substrate includes a recessed portion in which an electronic component is mounted and which is provided in a region surrounded by a region of the circuit substrate and the flexible wiring board connected to each other through the connector.

13. The endoscope according to claim 1 , further comprising:
a flexible wiring board which is electrically connected to the circuit substrate and to which a transmission cable is electrically connected, and
wherein the circuit substrate includes a recessed portion in which an electronic component is mounted and which is provided outside a region of the circuit substrate and the flexible wiring board connected to each other.

Assignees

• Fujifilm Corp

Inventors

• Kitano Ryo
• Sonoda Shinichiro
• Yano Takashi
• Suzuki Eiji

Classifications

• H05K2201/10378

  Interposers · CPC title

• A61B1/00096

  Optical elements · CPC title

• A61B1/053

  being detachable · CPC title

• A61B1/051 Primary

  Details of CCD assembly · CPC title

• A61B1/00101

  the distal tip features being detachable · CPC title