Endoscope image pickup unit

Patent metadata

Field	Value
Publication number	US-9411150-B2
Application number	US-201514751923-A
Country	US
Kind code	B2
Filing date	Jun 26, 2015
Priority date	Aug 5, 2013
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

In an endoscope image pickup unit including an image pickup device having connecting terminal portions on a back surface, and a flexible printed wiring board having a first region on which the image pickup device is mounted, a second region in which an external connection portion for connecting an electric cable is formed, a bent portion provided between the first region and the second region, and two conductive layers, input and output pads for performing input of a voltage to and input and output of signals to and from the image pickup device are disposed at a position closer to the bent portion than ground pads for connecting the image pickup device to a ground, and input and output wirings to be connected to the input and output pads are formed from a same conductive layer as the input and output pads.

First claim

What is claimed is:

1. An endoscope image pickup unit, comprising:
an image pickup device having a plurality of connecting terminal portions that are arranged on a back surface that is a surface at an opposite side from a light receiving surface; and
a flexible printed wiring board including a first conductive layer and a second conductive layer on a first surface and a second surface that is opposite from the first surface, respectively,
wherein the flexible printed wiring board comprises
a first region in which pads to be joined to the plurality of connecting terminal portions are formed,
a second region in which an external connection portion for connecting an electric cable is formed,
a bent portion that is provided between the first region and the second region, and bends the flexible printed wiring board with the second surface as an inner side, and
wirings that electrically connect the pads and the external connection portion,
the pads comprise
ground pads for connecting the image pickup device to a ground, and
input and output pads that are provided closer to the bent portion than the ground pads, and are for performing input of a voltage and input and output of signals to and from the image pickup device, and
the wirings comprise
input and output wirings that electrically connect the input and output pads and the external connection portion, and are formed from the first conductive layer at least in the image pickup device mounting portion and the bent portion, and
ground wirings that electrically connect the ground pads and the external connection portion, and are formed from the second conductive layer, at least in the image pickup device mounting portion and the bent portion.

2. The endoscope image pickup unit according to claim 1 ,
wherein an outer shape of the image pickup device is a rectangular shape,
the bent portion has a straight line or straight lines along one or a plurality of predetermined sides out of four outer sides of the image pickup device as a fold line or fold lines, and
the input and output pads are disposed in one row along the predetermined side or sides of the image pickup device, in an outermost perimeter of a group of all the pads.

Assignees

• Olympus Corp

Inventors

• Nagase Masatoshi

Classifications

• A61B1/051

  Details of CCD assembly · CPC title

• H04N25/00

  Circuitry of solid-state image sensors [SSIS]; Control thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/555

  for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes · CPC title

• G02B23/2484 Primary

  Arrangements in relation to a camera or imaging device (processing or control of video signals generated by an endoscope H04N23/60, H04N23/70) · CPC title