Techniques for combining CMP process tracking data with 3D printed CMP consumables

Patent metadata

Field	Value
Publication number	US-10593574-B2
Application number	US-201514935134-A
Country	US
Kind code	B2
Filing date	Nov 6, 2015
Priority date	Nov 6, 2015
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

First claim

What is claimed is:

1. A polishing pad apparatus, comprising:
a printed polymeric body comprising:
a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and
one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface of the plurality of polishing features, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

a radio frequency identification (RFID) tag integrally disposed within the printed polymeric body, wherein the RFID tag is positioned a distance from the polishing surface; and
a sensor integrally disposed within the printed polymeric body and communicatively coupled to the RFID tag.

2. The apparatus of claim 1 , wherein the first and second materials are selected from the group consisting of epoxies, phenolics, amines, polyesters, urethanes, silicon, acrylates, mixtures, copolymers, and grafts thereof.

3. The apparatus of claim 1 , wherein the RFID tag has an inductive antenna configured to communicate with an interrogator using a wireless communication technique.

4. The apparatus of claim 1 , wherein the distance is between about 200 μm to about 500 μm from the polishing surface.

5. The apparatus of claim 1 ,
wherein the sensor is selected from the group consisting of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, and a pressure sensor, and the RFID tag is configured to communicate with an interrogator using a wireless communication technique.

6. A chemical mechanical polishing system, comprising:
a platen having a supporting surface;
a printed polishing pad having a radio frequency identification (RFID) tag disposed therein, wherein the RFID tag stores a plurality of information associated with properties of the printed polishing pad, the printed polishing pad being disposed over the supporting surface of the platen and comprising:
a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and
one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface, the plurality of polishing features having a first height, the one or more base features having a second height, wherein the first height is greater than the second height, and wherein the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

an interrogator coupled to the platen, wherein the interrogator and the RFID tag are configured to communicate with one another using a wireless communication technique; and
a polishing head positioned opposite the platen, wherein the polishing head is configured to urge a substrate against the polishing surface of the printed polishing pad.

7. The polishing system of claim 6 , wherein the printed polishing pad is formed from an electrically non-conductive polymer material and the RFID tag is formed from an electrically conductive polymer material.

8. The polishing system of claim 6 , wherein the RFID tag comprises one or more of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, or a pressure sensor.

9. The polishing system of claim 6 , further comprising:
a retaining ring that includes an RFID tag disposed therein.

10. The polishing system of claim 6 , further comprising:
a flexible membrane that includes an RFID tag disposed therein.

11. The polishing system of claim 6 , wherein the interrogator is communicatively coupled to a controller that is adapted to monitor one or more processing parameters during a polishing process.

12. A method of polishing a substrate, comprising:
sensing one or more processing parameters with a radio frequency identification (RFID) tag disposed within a printed polishing pad, the RFID tag being communicatively coupled to a sensor disposed within the printed polishing pad, the printed polishing pad comprising:
a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric rings; and
one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface and the one or more base features and the one or more polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

receiving, via an interrogator, one or more signals from the RFID tag; and
communicating the one or more signals to a controller adapted to control the polishing process, wherein the controller initiates a change in the polishing process in response to receiving the one or more signals.

13. The method of claim 12 , wherein the one or more signals contain information generated by the sensor, wherein the sensor comprises one or more of a thermal sensor, an acoustic sensor, a conductivity sensor, an acceleration sensor, a torque sensor, a friction sensor, or a pressure sensor.

14. A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to implement a substrate polishing process, by performing the operations of:
causing initiation of a substrate polishing process;
receiving signals corresponding to one or more processing parameters, wherein the signals are generated by a wireless communication apparatus disposed within a printed polishing pad, the wireless communication apparatus comprising a radio frequency identification (RFID) tag and a sensor communicatively coupled to the RFID tag, the printed polishing pad comprising:
a plurality of polishing features comprising a first material and defining a polishing surface configured to contact a substrate, wherein the plurality of polishing features are arranged in concentric ring; and
one or more base features comprising a second material different than the first material, wherein the one or more base features are disposed a distance from the polishing surface, and the one or more base features and the plurality of polishing features are disposed in an alternating arrangement along a direction parallel to the polishing surface;

analyzing the signals to determine processing conditions; and
changing at least one of the one or more processing parameters in response to the processing conditions.

15. The non-transitory computer-readable medium of claim 14 , wherein the processing parameters corresponding to the signals comprise one or more of a thermal signal, an acoustic signal, a conductivity signal, an acceleration signal, a torque signal, a friction signal, or a pressure signal.

16. The non-transitory computer-readable medium of claim 14 , wherein the changing at least one of the one or more processing parameters is performed during the substrate polishing process.

17. The apparatus of claim 1 , wherein a recess is formed in the printed polymeric body, and the RFID tag

Assignees

• Applied Materials Inc

Inventors

• Fung Jason G
• Bajaj Rajeev
• Redfield Daniel
• Khanna Aniruddh
• Cornejo Mario
• Menk Gregory E
• Watkins John

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/0618

  using identification means, e.g. labels on substrates or labels on containers · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title