Airtight package and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-10586745-B2
Application number	US-201716090824-A
Country	US
Kind code	B2
Filing date	Feb 20, 2017
Priority date	Jun 29, 2016
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

Provided are an airtight package that can increase the bonding strength between the sealing material layer and the container and a method for manufacturing the same. An airtight package 1 includes: a container 2 with a frame 3; a glass lid 4 disposed on top of the frame 3 and sealing the container 2; and a sealing material layer 5 disposed between the frame 3 and the glass lid 4 and bonding the glass lid 4 and the container 2 together, wherein in the sealing material layer 5 a bonding surface 5b between the sealing material layer 5 and the container 2 is larger than a bonding surface 5a between the sealing material layer 5 and the glass lid 4.

First claim

The invention claimed is:

1. An airtight package comprising:
a container with a frame;
a glass lid disposed on top of the frame and sealing the container; and
a sealing material layer disposed between the frame and the glass lid and bonding the glass lid and the container together, wherein
in the sealing material layer a bonding surface between the sealing material layer and the container is larger than a bonding surface between the sealing material layer and the glass lid, and
a cross section of the sealing material layer in a direction perpendicular to a direction of extension of the sealing material layer along the frame has a tapered shape widening from the bonding surface between the sealing material layer and the glass lid toward the bonding surface between the sealing material layer and the container.

2. The airtight package according to claim 1 , wherein the sealing material layer has a thickness within a range of 1 to 100 μm.

3. The airtight package according to claim 1 , wherein the sealing material layer contains at least one metal selected from the group consisting of Fe, Mn, and Cu or an oxide of the at least one metal in a content of 5% by mass or less.

4. The airtight package according to claim 1 , wherein the container is made of aluminum nitride.

5. An electronic device comprising: the airtight package according to claim 1 ; and a device housed in the airtight package.

6. A method for manufacturing the airtight package according to claim 1 , the method comprising the steps of:
preparing the container with the frame, the glass lid that seals the container, and the sealing material layer that bonds the glass lid and the container together;
disposing the sealing material layer between the frame and the glass lid to lay the glass lid on top of the container; and
irradiating the sealing material through the glass lid with laser light brought to focus on or around an interface between the frame and the sealing material layer, thus bonding the glass lid and the container with the sealing material layer.

7. The method for manufacturing an airtight package according to claim 6 , wherein the sealing material layer has a permeability of 10% or more to wavelength of the laser light.

8. The method for manufacturing an airtight package according to claim 6 , wherein the sealing material layer is disposed between the frame and the glass lid by laying on top of the container the glass lid having the sealing material layer formed thereon.

9. The method for manufacturing an airtight package according to claim 6 , wherein the sealing material layer is disposed to lie within a top surface of the frame when the glass lid is laid on top of the container.

Assignees

• Nippon Electric Glass Co

Inventors

• Oka Takuji
• Yabuuchi Koichi
• Shiragami Toru

Classifications

• H01L23/08

  Electricity · mapped topic

• H01L21/50

  Electricity · mapped topic

• H01L2933/0033

  Electricity · mapped topic

• H01L2924/16195

  Electricity · mapped topic

• H01L33/48

  Electricity · mapped topic