Method for coating thin film in rolling manner and apparatus for coating thin film by using the same

US10583452B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10583452-B2
Application numberUS-201715480863-A
CountryUS
Kind codeB2
Filing dateApr 6, 2017
Priority dateSep 22, 2016
Publication dateMar 10, 2020
Grant dateMar 10, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for coating a thin film in a rolling manner and a thin film coating apparatus are provided. The method includes: floating a thin film material on a liquefied material; rolling a cylindrical substrate after contacting the cylindrical substrate with the thin film material; and coating the thin film material on a surface of the cylindrical substrate by using an attraction force between the surface of the cylindrical substrate and the thin film material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for coating a thin film in a rolling manner, the method comprising: removing a sacrificial layer after depositing a thin film material on the sacrificial layer; floating the thin film material from which the sacrificial layer has been removed on a liquefied material; rolling a cylindrical substrate after contacting the cylindrical substrate with the thin film material; and coating the thin film material on a surface of the cylindrical substrate by using an attraction force between the surface of the cylindrical substrate and the thin film material. 2. The method of claim 1 , wherein the attraction force is greater than an adhesive force between the liquefied material and the thin film material. 3. The method of claim 1 , wherein the sacrificial layer comprises at least one of Cu and Ni. 4. The method of claim 3 , wherein, in the removing, the sacrificial layer is removed by using an etchant. 5. The method of claim 1 , wherein the thin film material comprises a plurality of layers. 6. The method of claim 5 , wherein the thin film material comprises a first thin film material and a second thin film material, and wherein the first thin film material and the second thin film material are different from each other. 7. A method for coating a thin film in a rolling manner, the method comprising: forming a sacrificial layer on a planar substrate; depositing a thin film material on the sacrificial layer; removing the planar substrate and the sacrificial layer; floating the thin film material from which the planar substrate and the sacrificial layer have been removed on a liquefied material; rolling a cylindrical substrate after contacting the cylindrical substrate with the thin film material; coating the thin film material on a surface of the cylindrical substrate during the rolling of the cylindrical substrate; reinforcing the thin film material coated on the surface of the cylindrical substrate; and completing a tubular thin film by removing the cylindrical substrate after reinforcing the thin film material. 8. The method of claim 7 , wherein the completing a tubular thin film comprises removing the cylindrical substrate by contracting the cylindrical substrate or by using an etchant.

Assignees

Inventors

Classifications

  • Separation of the coating from the substrate · CPC title

  • on temporary substrates, e.g. substrates subsequently removed by etching · CPC title

  • Metallic sublayers · CPC title

  • characterised by the deposition of metallic material · CPC title

  • using a temporary backing to which the coating has been applied · CPC title

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What does patent US10583452B2 cover?
A method for coating a thin film in a rolling manner and a thin film coating apparatus are provided. The method includes: floating a thin film material on a liquefied material; rolling a cylindrical substrate after contacting the cylindrical substrate with the thin film material; and coating the thin film material on a surface of the cylindrical substrate by using an attraction force between th…
Who is the assignee on this patent?
Korea Advanced Inst Sci & Tech
What technology area does this patent fall under?
Primary CPC classification C23C14/0005. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).