Gold wetting on ceramic surfaces upon coating with titanium hydride

Patent metadata

Field	Value
Publication number	US-10583302-B2
Application number	US-201715712669-A
Country	US
Kind code	B2
Filing date	Sep 22, 2017
Priority date	Sep 23, 2016
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

The application of a titanium hydride coating on a ceramic, preferably an alumina ceramic, as a facile and inexpensive approach to bond gold to the ceramic during brazing is described. During the brazing process, the deposited titanium hydride is first partially decomposed to form pure titanium intermixed with titanium hydride. The combination of pure titanium and titanium hydride contributes to improved adhesion of gold with the alumina ceramic without any detrimental reaction between pure titanium and gold. The titanium hydride coating can be applied by dip/spray/paint coating.

First claim

What is claimed is:

1. A hermetic feedthrough for an implantable medical device, the feedthrough comprising:
a) a ferrule defining a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an implantable medical device;
b) an insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals an outer sidewall of the insulator to the ferrule, wherein at least one insulator passageway defined by an insulator inner surface extends through the insulator to an insulator first end surface and an insulator second end surface; and
c) an electrically conductive terminal pin residing in the at least one insulator passageway where a second gold braze hermetically seals the terminal pin to the insulator,
d) wherein at least one of the first and second gold brazes has the following respective braze profile:
A) the insulator outer sidewall contacting a titanium and titanium hydride mixture layer contacting gold contacting the ferrule; and
B) the insulator inner surface contacting a titanium and titanium hydride mixture layer contacting gold contacting the terminal pin, and

e) wherein, in the braze profile for at least one of the first and second gold brazes, the titanium and titanium hydride mixture layer includes at least one residual inorganic binder selected from colloidal silica and sodium silicate.

2. The feedthrough of claim 1 , wherein, in the braze profile for at least one of the first and second gold brazes, the titanium hydride has a 200-mesh size or a diameter of about 74 μm.

3. The feedthrough of claim 1 , wherein, in the braze profile for at least one of the first and second gold brazes, the titanium and titanium hydride mixture layer has a thickness of from about 148 μm to about 1,000 μm.

4. The feedthrough of claim 1 , wherein, in both the first and second gold braze profiles, there is a titanium and titanium hydride mixture layer that includes at least one residual inorganic binder selected from colloidal silica and sodium silicate.

5. The feedthrough of claim 1 , wherein, in the braze profile for at least one of the first and second gold brazes, the titanium and titanium hydride mixture layer has a thickness that is greater than zero, but less than about 1,000 μm.

6. The feedthrough of claim 1 , wherein the ferrule is selected from the group consisting of titanium, tantalum, niobium, stainless steel, and combinations of alloys thereof.

7. The feedthrough of claim 1 , wherein the insulator is selected from the group consisting of an alumina ceramic, aluminum nitride, boron nitride, silicon carbide, glass, and combinations thereof.

8. The feedthrough of claim 1 , wherein the terminal pin is selected from the group consisting of platinum, platinum-iridium alloys, palladium, and palladium alloys.

9. The feedthrough of claim 1 , wherein the terminal pin extends from a terminal pin first portion to a terminal pin second portion, and wherein the terminal pin first portion extends outwardly beyond the insulator first end surface and the terminal pin second portion extends outwardly beyond the insulator second end surface.

Assignees

• Greatbatch Ltd

Inventors

• Li Dongfa
• Das Biswa P
• Shah Ashish

Classifications

• A61N1/3754 Primary

  Feedthroughs · CPC title

• H01B17/301

  Sealing of insulators to support · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• H01G4/35

  Feed-through capacitors or anti-noise capacitors · CPC title

• C01B6/02

  Hydrides of transition elements; Addition complexes thereof · CPC title