Multilayer printed wiring board and multilayer metal clad laminated board

Patent metadata

Field	Value
Publication number	US-10568201-B2
Application number	US-201716072680-A
Country	US
Kind code	B2
Filing date	Jan 24, 2017
Priority date	Jan 26, 2016
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

First claim

The invention claimed is:

1. A multilayer printed wiring board, comprising:
conductive layers; and
insulating layers,
the conductive layers and the insulating layers being alternately stacked,
each of the insulating layers including one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer,
at least one of the insulating layers including a polyolefin resin layer, the polyolefin resin layer containing:
a component (A) representing a polyolefin-based elastomer and
a component (B) representing a thermosetting resin, and
the component (A) having a concentration from 50 wt. % to 95 wt. % in an entirety of the polyolefin resin layer,
the component (A) is one or more selected from a group consisting of polystyrene-poly (ethylene/propylene) block-polystyrene copolymer, polystyrene-poly (ethylene-ethylene/propylene) block-polystyrene copolymer, polystyrene-poly (ethylene/butylene) block-polystyrene copolymer, polystyrene-polyisoprene block copolymer, hydrogenated polystyrene-polyisoprene-polybutadiene block copolymer, polystyrene-poly (butadiene/butylene) block-polystyrene copolymer, ethylene-glycidyl methacrylate copolymer, ethylene-glycidyl methacrylate-methyl acrylate copolymer, and ethylene-glycidyl methacrylate-vinyl acetate copolymer.

2. The multilayer printed wiring board according to claim 1 , wherein
two insulating layers serve as the insulating layers,
the conductive layers are stacked alternately with the two insulating layers,
one insulating layer of the two insulating layers includes one or more selected from a group consisting of a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer, and
the other of the two insulating layers includes a polyolefin resin layer.

3. The multilayer printed wiring board according to claim 1 , wherein
the component (B) contains one or more components selected from a group consisting of an epoxy resin, a phenol resin, a bismaleimide resin, and a polyphenylene ether oligomer having vinyl groups at both ends.

4. The multilayer printed wiring board according to claim 1 , wherein
the polyolefin resin layer further contains a component (C) representing a curing accelerator.

5. The multilayer printed wiring board according to claim 1 , wherein
the polyolefin resin layer further contains a component (D) representing filler.

6. The multilayer printed wiring board according to claim 1 , wherein
the polyolefin resin layer after a process at 180° C. for 60 minutes has a storage elastic modulus within a range of 10 5 Pa to 10 8 Pa at a temperature ranging from 25° C. to 150° C.

Assignees

• Panasonic Ip Man Co Ltd
• Tomoegawa Co Ltd

Inventors

• Takahashi Hiroaki
• Aoki Tomoyuki
• Komori Kiyotaka
• Tochihira Jun
• Harada Ryu

Classifications

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/036

  Multilayers with layers of different types · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title

• B32B27/281

  comprising polyimides · CPC title