Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil
US-11818835-B2 · Nov 14, 2023 · US
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Harada Ryu patents
Harada Ryu is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Harada Ryu |
| Total patents | 9 |
| First publication | Sep 13, 2018 |
| Latest publication | Nov 14, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil
US-2021176854-A1 · Jun 10, 2021 · US
Thermosetting adhesive composition, thermosetting adhesive film, and composite film
US-10822527-B2 · Nov 3, 2020 · US
Resin-clad metal foil and flexible printed wiring board
US-10751976-B2 · Aug 25, 2020 · US
Multilayer printed wiring board and multilayer metal clad laminated board
US-10568201-B2 · Feb 18, 2020 · US
Resin-clad metal foil and flexible printed wiring board
US-2019061320-A1 · Feb 28, 2019 · US
Multilayer printed wiring board and multilayer metal clad laminated board
US-2018376579-A1 · Dec 27, 2018 · US
Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil
US-2018270945-A1 · Sep 20, 2018 · US
Thermosetting adhesive composition, thermosetting adhesive film, and composite film
US-2018258324-A1 · Sep 13, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tomoegawa Co Ltd | 9 |
| Panasonic Ip Man Co Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B27/32 | 9 |
| B32B15/08 | 9 |
| H05K2201/0158 | 7 |
| B32B15/20 | 7 |
| H05K1/036 | 7 |