Platinum and cobalt/copper-based multilayer thin film having low saturation magnetization and fabrication method thereof

US10566522B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10566522-B2
Application numberUS-201715410535-A
CountryUS
Kind codeB2
Filing dateJan 19, 2017
Priority dateMay 22, 2012
Publication dateFeb 18, 2020
Grant dateFeb 18, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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A multilayer thin film for magnetic random access memory that includes thin platinum layers and thin cobalt-copper layers, and more particularly, to a multilayer thin film having magnetic layers including non-magnetic material copper that replaces a portion of the magnetic material cobalt.

First claim

Opening claim text (preview).

What is claimed is: 1. A perpendicular magnetic anisotropy multilayer thin film for a magnetic random access memory, comprising: a platinum layer and a cobalt-copper layer alternately deposited to form a multilayer thin film over a substrate, wherein the cobalt-copper layer is thicker than the platinum layer; wherein a content atomic ratio of cobalt:copper in the cobalt-copper layers is 50:50 to 90:10; wherein the multilayer thin film including the platinum layer and the cobalt-copper layer is repeatedly stacked over the substrate 2-10 turns; wherein the multilayer thin film has a total thickness of 0.3 nm-12.5 nm; and wherein the multilayer thin film has a perpendicular magnetic anisotropy (PMA) energy density of 0.23˜5.66×10 6 erg/cm 3 at 300˜500 Celsius degrees, and a saturation magnetization value of 735 emu/cc or less. 2. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein a thickness f the platinum layer in the multilayer thin film ranges from 0.15 nm to 0.25 nm. 3. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein the thickness ratio of the cobalt-copper layer to the platinum layer is 1.1:1˜4.0:1. 4. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , further comprising: a stack of a buffer layer and a seed layer, which are provided between the substrate and the multilayer thin film, and a protective layer deposited over the multilayer thin film. 5. The perpendicular magnetic anisotropy multilayer thin film of claim 4 , wherein each of the buffer layer, the seed layer, and the protective layer independently includes gold (Au), palladium (Pd), copper (Cu), platinum (Pt), tantalum (Ta), ruthenium (Ru), or a combination thereof. 6. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein a critical current value required for a perpendicular magnetization switching is 1 MA/cm 2 or less. 7. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein the platinum layer has a thickness of 0.2 nm and the cobalt-copper layer has a thickness of 0.4, or 0.5 or 0.6 nm. 8. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein a content atomic ratio of cobalt:copper in the cobalt-copper layer is 85/15 to 70/30. 9. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein a thickness of the platinum layer in the multilayer thin film ranges from 0.15 nm to 0.25 nm and a ratio of a thickness of the cobalt-copper layer to the thickness of the platinum layer is 0.6:1 to 4.0:1. 10. The perpendicular magnetic anisotropy multilayer thin film of claim 1 , wherein the multilayer thin film has a total thickness of 0.96 nm-12.5 nm. 11. The perpendicular magnetic anisotropy multilayer thin of claim 1 , wherein the substrate is made of a material selected from the group consisting of silicon, glass, sapphire and magnesium oxide. 12. A magnetic random access memory device comprising the perpendicular magnetic anisotropy multilayer thin film of claim 1 .

Assignees

Inventors

Classifications

  • Exchange coupled hard/soft multilayers, e.g. CoPt/Co or NiFe/CoSm (nanocomposite spring magnets H01F1/0579) · CPC title

  • H01L43/10Primary

    Electricity · mapped topic

  • made of a noble metal, e.g.(Co/Pt) n multilayers having perpendicular anisotropy (H01F10/3286 takes precedence) · CPC title

  • H10N50/85Primary

    Materials of the active region · CPC title

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What does patent US10566522B2 cover?
A multilayer thin film for magnetic random access memory that includes thin platinum layers and thin cobalt-copper layers, and more particularly, to a multilayer thin film having magnetic layers including non-magnetic material copper that replaces a portion of the magnetic material cobalt.
Who is the assignee on this patent?
Sk Hynix Inc
What technology area does this patent fall under?
Primary CPC classification H01L43/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).