Drying apparatus

Patent metadata

Field	Value
Publication number	US-10566217-B2
Application number	US-201816015162-A
Country	US
Kind code	B2
Filing date	Jun 21, 2018
Priority date	Mar 27, 2018
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.

First claim

What is claimed is:

1. A drying apparatus, comprising:
an oven body having a chamber which is air-hermetic for receiving a semiconductor package element;
a chamber pressure controlling device that is connected to the chamber, and is configured to reduce a chamber pressure of the chamber;
a magnetic field generating device that is connected to the chamber, and is configured to polarize liquid on the semiconductor package element in the chamber; and
a baking device that is connected to the chamber, and is configured to heat to remove the liquid on the semiconductor package element in the chamber.

2. The drying apparatus of claim 1 , wherein the magnetic field generating device comprises:
a magnetic tubular structure disposed in the oven body, and formed by encircling with magnetic elements and silicon steel sheets, wherein the magnetic elements are collaboratively combined together, and each of the silicon steel sheets is sandwiched by two adjacent ones of the magnetic elements; and a hollow space is formed in the magnetic tubular structure and is surrounded by the magnetic elements for receiving the semiconductor package element.

3. The drying apparatus of claim 2 , wherein each of the magnetic elements is a permanent magnet which is shaped as a curved tile.

4. The drying apparatus of claim 2 , wherein the magnetic elements are arranged in accordance with a manner of Halbach Array.

5. The drying apparatus of claim 1 , wherein the magnetic field generating device is configured to polarize the liquid on the semiconductor package element in accordance with a predetermined magnetic field intensity, wherein the predetermined magnetic field intensity is 1000±30% mGs.

6. The drying apparatus of claim 1 , wherein the chamber pressure controlling device is configured to regulate the chamber pressure between 0 and 1 Atmosphere.

7. The drying apparatus of claim 1 , wherein the chamber pressure controlling device is configured to regulate the chamber pressure to 0.25-0.3 Atmosphere.

8. The drying apparatus of claim 1 , wherein the baking device dries the semiconductor package element in the chamber in accordance with a predetermined temperature, wherein the predetermined temperature is 125° C.±25°.

9. The drying apparatus of claim 1 , wherein the baking device dries the semiconductor package element in the chamber in accordance with a constant temperature, wherein the constant temperature is 125° C. or 150° C.

10. A drying apparatus, comprising:
an oven body having a chamber which is air-hermetic for receiving a semiconductor package element;
a chamber pressure controlling device that is connected to the chamber, and is configured to reduce a chamber pressure of the chamber;
a magnetic field generating device that is connected to the chamber, and is configured to surround the semiconductor package element, so as to polarize liquid on the semiconductor package element in the chamber; and
a heater that is connected to the chamber, and is configured to supply thermal energy to the chamber with an collaborative operation of the magnetic field generating device and the chamber pressure controlling device; and
an airflow guiding device that is connected to the chamber, and is configured to provide airflows to transfer the thermal energy from the heater to the liquid on the semiconductor package element, thereby drying the semiconductor package element.

Assignees

• Global Unichip Corp
• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Manufactoring Co Ltd

Inventors

• Liao Chih-Chieh
• Sun yu-min
• Cheng Chih-Feng

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0408 Primary

  for drying · CPC title

• F26B3/04

  the gas or vapour circulating over or surrounding the materials or objects to be dried (F26B3/14 takes precedence) · CPC title

• F26B5/04 Primary

  by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum {(F26B11/049 and F26B17/128 take precedence)} · CPC title

• F26B25/00

  Details of general application not covered by group F26B21/00 or F26B23/00 (loading, conveying, and unloading in general B65G) · CPC title