Methods related to implementing surface mount devices with ground paths

Patent metadata

Field	Value
Publication number	US-10561012-B2
Application number	US-201715729632-A
Country	US
Kind code	B2
Filing date	Oct 10, 2017
Priority date	Apr 16, 2013
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configured to receive a plurality of components and the packaging substrate including a ground plane. In some embodiments, the method includes mounting a surface mount device on the packaging substrate, and forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device.

First claim

What is claimed is:

1. A method for fabricating a radio-frequency module, the method comprising:
providing a packaging substrate, the packaging substrate configured to receive a plurality of components, the packaging substrate including a ground plane;
mounting a surface mount device on the packaging substrate;
forming an overmold over the packaging substrate, the overmold encapsulating the surface mount device;
forming an opening defined in the overmold at a region over the surface mount device, the opening having sufficient depth to expose a region of the surface mount device; and
forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device, the first and second regions being within the radio-frequency module.

2. The method of claim 1 wherein mounting the surface mount device includes inverting the surface mount device from its designed usage orientation, the surface mount device including a conductive feature that faces upward and in electrical contact with the conductive layer in the inverted orientation.

3. The method of claim 1 wherein each of the first and second regions is on the packaging substrate.

4. The method of claim 1 wherein the surface mount device includes a functional component.

5. The method of claim 4 further comprising:
implementing an upper connection feature of the functional component in electrical contact with the conductive layer;
implementing a lower connection feature of the functional component in electrical contact with the ground plane; and
configuring at least one interconnection feature to electrically connect the conductive layer with the ground plane.

6. The method of claim 5 wherein the functional component includes a functional die such that the upper connection feature includes a metal layer formed on one side of the die.

7. The method of claim 6 wherein the at least one interconnection feature includes at least one through-die conductive via.

8. The method of claim 7 wherein the lower connection feature includes a contact feature that electrically connects the through-die conductive via with the ground plane.

9. The method of claim 8 wherein the die includes a radio-frequency filter.

10. The method of claim 9 wherein the radio-frequency filter is a chip size surface acoustic wave (SAW) device (CSSD).

11. The method of claim 9 further comprising mounting the die on the surface of the packaging substrate in an orientation that is inverted relative to its designed usage orientation.

12. The method of claim 1 further comprising implementing a plurality of shielding-wirebonds relative to the surface mount device, the plurality of wirebonds configured to provide the radio-frequency shielding in combination with the surface mount device.

13. The method of claim 12 further comprising positioning the surface mount device on the packaging substrate to provide shielding along a segment that would otherwise be shielded by one or more shielding-wirebonds.

14. The method of claim 13 further comprising implementing a conductive racetrack under the plurality of shielding-wirebonds, the conductive racetrack electrically connected to the shielding-wirebonds and a ground plane within the packaging substrate.

15. The method of claim 14 further comprising positioning the surface mount device along an edge of the packaging substrate.

16. The method of claim 15 wherein a portion of the edge occupied by the surface mount device is substantially free of the conductive racetrack.

17. The method of claim 1 further comprising forming a radio-frequency shield relative to the surface mount device, the radio-frequency shield including a plurality of shielding wirebonds and at least one shielding-component, the at least one shielding component configured to replace one or more shielding wirebonds.

18. The method of claim 17 wherein forming the radio-frequency shield includes mounting the at least one shielding-component in a position along a selected edge of the packaging substrate.

Assignees

• Skyworks Solutions Inc

Inventors

• Chen Howard E

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/5453

  connecting between multiple bond pads on a chip, e.g. daisy chain · CPC title