Method for fabricating LED module using transfer tape

Patent metadata

Field	Value
Publication number	US-10559554-B2
Application number	US-201715558192-A
Country	US
Kind code	B2
Filing date	Aug 1, 2017
Priority date	Aug 11, 2016
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

First claim

What is claimed is:

1. A method for fabricating an LED module, comprising:
constructing a chip-on-carrier comprising a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and
transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing,
wherein the transfer printing comprises:
primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape;
disposing the transfer tape such that the bonding areas are positioned between the LED chips on the chip retainer and a pick-up roller rolling in one direction;
pressurizing the transfer tape against the LED chips on the chip retainer with the pick-up roller to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips;
after the chip pick-up, moving the transfer tape between a placing roller and the substrate such that the LED chips attached to the transfer tape are positioned between the placing roller and the substrate;
irradiating UV light onto the transfer tape carrying the LED chips with a UV light source positioned above the transfer tape to weaken the adhesive strength of the bonding areas of the transfer tape; and
pressurizing the LED chips on the transfer tape against the substrate with the placing roller rolling in one direction, such that the LED chips attached to the bonding areas of the transfer tape whose adhesive strength are weakened by the UV light are detached from the transfer tape and placed on the substrate, wherein the electrode pads of the LED chips are attached to pairs of bumps formed on the substrate.

2. The method according to claim 1 , wherein the primary exposure comprises exposing the transfer tape through a photomask formed with a plurality of light-transmitting windows.

3. The method according to claim 1 , wherein the adhesive strength of the transfer tape during the placing is lower than the adhesive strength of an adhesive loaded on the pairs of bumps.

4. The method according to claim 1 , wherein the chip-on-carrier construction comprises preparing a chip retainer having a horizontal bonding plane, preparing a plurality of LED chips, and attaching the LED chips onto the bonding plane to form one or more LED chip arrays wherein the preparation of a plurality of LED chips comprises preparing a plurality of LED chips comprising downwardly extending n-type electrode pads and p-type electrode pads and the chip attachment comprises directly bonding the n-type electrode pads and the p-type electrode pads to the bonding plane.

5. The method according to claim 4 , wherein the chip attachment comprises attaching the plurality of LED chips to the bonding plane such that the pitch in the LED chip arrays on the chip retainer is one-n th (where n is a natural number equal to or greater than 1) of that in the LED chip arrays transferred to the substrate by the transfer printing, the pitch representing the horizontal distance between the center of one LED chip and the center of the adjacent LED chip.

Assignees

• Lumens Co Ltd

Inventors

• Yoo Taekyung
• Kim Daewon
• Kim Jinmo
• Choi Jinwon
• Her Jimin
• Shin Younghwan
• Han Sol
• Lee Kyujin

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title