Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and inspection method

Patent metadata

Field	Value
Publication number	US-10559505-B2
Application number	US-201515112940-A
Country	US
Kind code	B2
Filing date	Jan 21, 2015
Priority date	Jan 22, 2014
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

Provided is a sheet (2) for forming protective film, including: a protective film-forming film (1) characterized in that the light transmittance thereof at a wavelength of 1600 nm of 72% or more, and the light transmittance thereof at a wavelength of 550 nm of 20% or less; and a release sheet (21) laminated upon one or both faces of the protective film-forming film (1). According to this sheet (2) for forming a protective film, it is possible to form a protective film that allows for the inspection of cracks, etc., on a workpiece or a product obtained by processing the workpiece, while preventing grinding marks on the workpiece or the product from being visible to the naked eye.

First claim

The invention claimed is:

1. An inspection method comprising: adhering a protective film-forming film to a semiconductor wafer; curing the protective film-forming film to obtain a semiconductor wafer provided with a protective film; and, irradiating infrared rays to the semiconductor wafer provided with the protective film or a semiconductor chip obtained by processing the semiconductor wafer provided with the protective film, to inspect presence of cracks which cannot be detected by visual observation in the semiconductor wafer provided with the protective film or the semiconductor chip provided with the protective film; wherein the light transmittance at a wavelength of 1600 nm of the protective film-forming film is 72% or greater, and the light transmittance at a wavelength of 550 nm of the protective film-forming film is 20% or less.

2. The inspection method according to claim 1 ,
wherein the protective film-forming film comprises a colorant and a filler having an average particle diameter of 0.01 to 3 μm.

3. An inspection method comprising:
laminating a release sheet on one or both surfaces of a protective film-forming film to obtain a sheet for forming a protective film,
adhering the sheet for forming a protective film to a semiconductor wafer,
curing the protective film-forming film to obtain a semiconductor wafer provided with a protective film; and
irradiating infrared rays to the semiconductor wafer provided with the protective film or a semiconductor chip obtained by processing the semiconductor wafer provided with the protective film, to inspect presence of cracks which cannot be detected by visual observation in the semiconductor wafer provided with the protective film or the semiconductor chip provided with the protective film;
wherein the light transmittance at a wavelength of 1600 nm of the protective film-forming film is 72% or greater, and
the light transmittance at a wavelength of 550 nm of the protective film-forming film is 20% or less.

4. The inspection method according to claim 3 ,
wherein the protective film-forming film comprises a colorant and a filler having an average particle diameter of 0.01 to 3 μm.

5. An inspection method comprising:
laminating an adhesive sheet on a pressure sensitive adhesive layer on one surface side of a base material,
laminating a protective film-forming film on the pressure sensitive adhesive layer side of the adhesive sheet to obtain a composite sheet for forming a protective film,
adhering the composite sheet for forming a protective film to a semiconductor wafer,
curing the protective film-forming film to obtain a semiconductor wafer provided with a protective film; and
irradiating infrared rays to the semiconductor wafer provided with the protective film or a semiconductor chip obtained by processing the semiconductor wafer provided with the protective film, to inspect presence of cracks which cannot be detected by visual observation in the semiconductor wafer provided with the protective film or the semiconductor chip provided with the protective film;
wherein the light transmittance at a wavelength of 1600 nm of the protective film-forming film is 72% or greater, and
the light transmittance at a wavelength of 550 nm of the protective film-forming film is 20% or less.

6. The inspection method according to claim 5 ,
wherein the protective film-forming film comprises a colorant and a filler having an average particle diameter of 0.01 to 3 μm.

Assignees

• Lintec Corp

Inventors

• Yamamoto Daisuke
• Yoneyama Hiroyuki

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/27

  Structural arrangements therefor · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/47 Primary

  comprising organic materials, e.g. plastics or resins · CPC title