Polymer compound, surface treatment agent, laminated body using surface treatment agent, transistor, method for manufacturing laminated body

Patent metadata

Field	Value
Publication number	US-10550281-B2
Application number	US-201715659838-A
Country	US
Kind code	B2
Filing date	Jul 26, 2017
Priority date	Apr 10, 2015
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group].

First claim

The invention claimed is:

1. A polymer compound comprising a constituent unit represented by the following formula (1):

[in the formula (1), R 1 represents hydrogen or a methyl group, m represents an integer of 2 to 20, and Q represents a photosensitive leaving group],
wherein Q is at least one group represented by the following formula (2):

[in the formula (2), R 2 represents an alkyl group, R 3 and R 4 each independently represents an alkyl group or a fluoroalkyl group including a methyl group, and R 5 represents hydrogen or a nitro group].

2. The polymer compound according to claim 1 , wherein the compound represented by the formula (1) has a number average molecular weight of 1000 to 5000.

3. The polymer compound according to claim 1 , comprising no alkoxysilane.

4. The polymer compound according to claim 1 , wherein at least one terminal of the compound represented by the formula (1) comprises a substitute represented by the following general formula (13):

5. The polymer compound according to claim 1 , wherein terminals of the compound represented by the formula (1) comprise substitutes represented by the following formula (14) and the following formula (15):

6. The polymer compound according to claim 1 , wherein terminals of the compound represented by the formula (1) comprise substitutes represented by the following formula (16) and the following formula (17):

7. A surface treatment agent comprising the polymer compound according to claim 1 .

8. A laminated body comprising the surface treatment agent according to claim 7 .

9. A transistor comprising the surface treatment agent according to claim 7 .

10. A method for manufacturing a laminated body, the method comprising the steps of: forming a photosensitive polymer layer by applying the surface treatment agent according to claim 7 ; exposing the photosensitive polymer layer to predetermined pattern light; providing a catalyst for electroless plating on the exposed region of the photosensitive polymer layer; and bringing the photosensitive polymer layer into contact with an electroless plating solution, thereby carrying out electroless plating.

Assignees

• Nikon Corp

Inventors

• Kawakami Yusuke
• Koizumi Shohei
• Sugizaki Takashi

Classifications

• C23C18/20

  of organic surfaces, e.g. resins · CPC title

• C23C18/2066

  Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers · CPC title

• C23C18/36

  using hypophosphites · CPC title

• C23C18/2026

  by radiant energy · CPC title

• H05K3/181

  by electroless plating (adhesives therefor H05K3/387) · CPC title