Edge field imprint lithography

US10549313B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10549313-B2
Application numberUS-201615339281-A
CountryUS
Kind codeB2
Filing dateOct 31, 2016
Priority dateOct 31, 2016
Publication dateFeb 4, 2020
Grant dateFeb 4, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for an imprint lithography method of edge field patterning, the method including providing a template having a mold, the mold having a patterning surface comprising patterned features; providing a substrate having an edge step layer positioned thereon the edge step layer including a sloped profile; depositing a polymerizable material on the edge step layer of the substrate; contacting the polymerizable material at one or more of a plurality of edge fields located at a perimeter of the substrate with the mold of the template; and based on the contacting, forming a pattern based on the patterned features at the one or more edge fields to provide an edge field pattern, wherein contact between the template and the substrate proximate to the plurality of edge fields is prevented based on the edge step layer of the substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. An imprint lithography method of edge field patterning, the method comprising: providing an imprint lithography template having a mold, the mold having a patterning surface comprising patterned features; providing a substrate having a surface defining a first edge and an imprinting area having full imprint fields bounded by partial imprint fields, wherein each partial imprint field is bounded by up to two full imprint fields and has an edge step layer extending from the surface of the substrate, the edge step layer having a second edge a distance d from the first edge and a height h defined by a distance between the surface of the substrate and a surface of the edge step layer parallel to the surface of the substrate from which it extends, wherein a portion of the surface of the substrate between the first edge and the second edge is free of the edge step layer; drop dispensing a polymerizable material on the surface of the edge step layer of one of the partial imprint fields; contacting the polymerizable material on the edge step layer with the mold of the imprint lithography template; and based on the contacting, forming a pattern on the surface of the edge step layer based on the patterned features, wherein contact between the imprint lithography template and the portion of the substrate between the first edge and the second edge is prevented based on the edge step layer of the one of the partial imprint fields. 2. The method of claim 1 , wherein contact between the imprint lithography template and the portion of the substrate between the first edge and the second edge is prevented based on the height of the edge step layer. 3. The method of claim 1 , wherein the edge step layer includes a sloped profile, and wherein contact between the imprint lithography template and the portion of the substrate between the first edge and the second edge is prevented based on the sloped profile of the edge step layer. 4. The method of claim 1 , wherein contacting further includes identifying a degree of bending of the template at a perimeter of the substrate, wherein the height of the edge step layer is based on the degree of bending. 5. The method of claim 1 , wherein the height of the edge step layer ranges from ten nanometers to three microns. 6. The method of claim 1 , wherein the edge step layer includes a sloped profile, wherein contacting further includes identifying a degree of bending of the template at a perimeter of the substrate, and wherein a slope of the sloped profile at the perimeter of the substrate is based on the degree of bending. 7. The method of claim 1 , wherein the edge step layer further includes fluid control features positioned proximate the second edge. 8. The method of claim 7 , wherein the edge step layer includes a sloped profile, wherein contact between the imprint lithography template and the portion of the substrate between the first edge and the second edge is prevented based on i) the height of the edge step layer, and ii) the sloped profile of the edge step layer. 9. The method of claim 1 , wherein contacting the polymerizable material on the edge step layer with the mold of the imprint lithography template comprises positioning the imprint lithography template relative to the substrate such that a gap is present between the imprint lithography template and the portion of the surface of the substrate. 10. The method of claim 1 , wherein contacting the polymerizable material on the edge step layer with the mold of the imprint lithography template comprises positioning the imprint lithography template relative to the substrate such that a portion of patterning surface of the mold extends beyond the second edge of the edge step layer of the one of the partial imprint fields. 11. The method of claim 1 , wherein contacting the polymerizable material on the edge step layer with the mold of the imprint lithography template comprises positioning the imprint lithography template relative to the substrate such that a portion of the imprint lithography template overhangs the first edge. 12. The method of claim 1 , wherein contacting the polymerizable material on the edge step layer with the mold of the imprint lithography template comprises positioning the imprint lithography template relative to the substrate such that a portion of the imprint lithography template overhangs the second edge. 13. An imprint lithography method of manufacturing an article, the method comprising: providing an imprint lithography template having a mold, the mold having a patterning surface comprising patterned features; providing a substrate having a surface defining a first edge and an imprinting area having full imprint fields bounded by partial imprint fields, wherein each partial imprint field is bounded by up to two full imprint fields and has an edge step layer extending from the surface of the substrate, the edge step layer having a second edge a distance d from the first edge and a height h defined by a distance between the surface of the substrate and a surface of the edge step layer parallel to the surface of the substrate from which it extends, wherein a portion of the surface of the substrate between the first edge and the second edge is free of the edge step layer; drop dispensing a polymerizable material on the surface of the edge step layer of one of the partial imprint fields; contacting the polymerizable material on the edge step layer with the mold of the imprint lithography template, wherein contact between the imprint lithography template and the portion of the substrate between the first edge and the second edge is prevented based on the edge step layer of the one of the partial imprint fields; polymerizing the polymerizable material to form a polymeric layer in contact with the imprint lithography template, the polymeric layer including a pattern based on the patterned features; and separating the imprint lithography template from the polymeric layer to yield the article.

Assignees

Inventors

Classifications

  • Curing or cross-linking the coating · CPC title

  • B05D3/12Primary

    by mechanical means · CPC title

  • Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure · CPC title

  • G03F7/0002Primary

    Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • Photolithographic processes · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10549313B2 cover?
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for an imprint lithography method of edge field patterning, the method including providing a template having a mold, the mold having a patterning surface comprising patterned features; providing a substrate having an edge step layer positioned thereon the edge step layer including a sloped profile…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B05D3/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).