Method for producing a foil arrangement and corresponding foil arrangement

Patent metadata

Field	Value
Publication number	US-10548229-B2
Application number	US-201515314524-A
Country	US
Kind code	B2
Filing date	May 27, 2015
Priority date	Jun 3, 2014
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.

First claim

The invention claimed is:

1. A foil configuration, comprising:
a carrier foil having a carrier foil top side;
a conductive foil applied to said carrier foil top side and having a structuring and a conductive foil top side;
a protective layer applied to said conductive foil top side and having a protective layer top side;
a cover foil laminated onto said carrier foil top side at a location in which said protective layer is not between said cover foil and said carrier foil top side, said cover foil laminated onto said protective layer top side at another location; and
a connection pin extending through a hole formed in said carrier foil, said conductive foil, and said protective layer, said connection pin connected to said conductive foil;
said hole formed in said carrier foil, said conductive foil, and said protective layer having only one conductive element extending completely therethrough;
said conductive element being said connection pin; and
said protective layer top side facing away from said carrier foil, said protective layer top side including a portion adjacent said connection pin, and said portion of said protective layer top side adjacent said connection pin being not covered by said cover foil.

2. The foil configuration according to claim 1 , wherein said conductive foil contains a metal.

3. The foil configuration according to claim 1 , wherein said protective layer includes an electroplated layer.

4. The foil configuration according to claim 3 , wherein said electroplated layer contains at least one of gold, a gold alloy, nickel, a nickel alloy, tin or a tin alloy.

5. The foil configuration according to claim 2 , wherein said carrier foil contains a polyethylene or a polyimide.

6. The foil configuration according to claim 1 , wherein said conductive foil contains a metal selected from the group consisting of copper and a copper alloy.

7. The foil configuration according to claim 2 , wherein said carrier foil contains polybismaleimide, polybenzimidazole, polyoxadiazobenzimidazole, polyimide sulfone or polymethacrylimide.

Assignees

• Conti Temic Microelectronic Gmbh

Inventors

• Bock Johannes
• Rebelein Andreas
• Schulze Andreas
• Voegerl Andreas

Classifications

• H05K3/341

  Surface mounted components · CPC title

• C25D3/48

  of gold · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K2201/032

  Materials · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title